UP TO 40+ LAYERS
Sequential lamination, HDI microvias, and ±5% impedance control for 8–40+ layer boards used in telecom, datacenter, and industrial systems.
We build multilayer FR-4, high-Tg, and low-loss stackups up to 40+ layers with controlled impedance, buried/blind vias, and copper balancing for large form-factor panels.
Our CAM team optimizes sequential lamination, drill maps, via fill, and backdrill operations so dense signal, power, and reference layers stay aligned.
Assembly and testing include lead-free reflow, press-fit connectors, conformal coating, and electrical testing to deliver production-ready backplanes and controller boards.
Telecom backplanes, data-center fabrics, industrial controllers, and aerospace avionics built on multilayer stackups.
Impedance coupons, AOI/X-ray, CAF testing, and thermal stress verify multilayer builds that serve mission-critical markets.
We engineer complex stackups with HDI, buried vias, and large format panels needed for telecom and industrial applications.
Standard multilayer, high-Tg, low-loss, HDI, rigid-flex, and backplane architectures.
Select laminates for Tg, Df, and CTE, plus copper weights per power layer.
We run impedance coupons, X-ray, cross-sections, CAF, and thermal shock to ensure multilayer boards meet Class 3 and telecom/aerospace specs.
Stackup & DFx Review
Align materials, lamination cycles, and impedance goals.
Core Prep & Imaging
LDI imaging for fine geometries.
Sequential Lamination
Controlled cycles for HDI and high-layer builds.
Drill, Fill & Backdrill
Precision drilling plus via fill/backdrill operations.
Surface Finish & Mask
Apply ENIG/ENEPIG/OSP with color options.
Testing & Inspection
Impedance, electrical, AOI, X-ray, and reliability tests.
We simulate impedance, copper balance, and lamination sequences before release.
SPC-monitored lamination, drilling, plating, and inspection feed back to design.
Layer Capacity
High-complexity backplanes
Max Panel
Large-format compatibility
Standard Line/Space
HDI 2/2 mil available
Impedance
Coupon verified
High density, high reliability, and scalable production.
Support fine-pitch BGAs and SERDES fabrics.
±5% tolerance for differential pairs.
Class 3 inspection for harsh environments.
Low-loss options for 25–56 Gbps.
Prototype to mass production under one roof.
Complete stackup + test reports.
Multilayer stackups integrate signal, power, and reference planes in one controlled platform.
Telecom, datacenter, aerospace, automotive, medical, and industrial automation rely on multilayer stackups for density and reliability.
Balanced stackups combine signal, reference, and power planes in a single assembly.
Baseband, switch, and router fabrics.
Server backplanes and accelerator boards.
Central controllers and ADAS compute.
Mission computers and avionics.
Robotics and motor drives.
Diagnostic instruments and imaging systems.
Compact electronics needing mixed rigid/flex sections.
ATE load boards and instrumentation.
Control stackups, warpage, impedance, and sequential lamination without compromising yield.
High layer counts require balanced copper and dielectric selection.
Multiple routing layers need consistent dielectric control.
Unbalanced copper or resin flow causes bow/twist on large panels.
Deep vias and stacked microvias need proper plating and fill.
Incorrect stub removal impacts signal integrity.
Customers expect full stackup and test records.
Stackup Modeling
We optimize dielectric selections, copper balance, and lamination sequences.
Impedance Simulation
Coupons and modeling keep SI targets within ±5%.
Warpage Control
Copper thieving, cross-hatching, and panel design prevent bow/twist.
Via Process Control
Via fill and plating plans maintain reliability.
Backdrill Tooling
Depth tables and verification ensure consistent stub removal.
Innovation Roadmap
Emerging technologies shaping the future of manufacturing, signal integrity, and system integration.
01
Modified Semi-Additive Process for ultra-fine traces and microvias in multilayer designs.
02
Resistors, capacitors, and inductors buried in stackups for compact, high-density modules.
03
Large-format 24–50 layer backplanes with low-loss materials for AI server interconnects.
04
EM simulation-validated stackups paired with eco-friendly, low-halogen laminates for predictive SI and carbon goals.
Higher layer counts and HDI features add cost—apply them only where density demands. Standardize stackups, drill sets, and panel sizes to shorten quoting and fabrication. Share routing density, impedance, and panelization goals early so we can recommend the leanest build.
Reuse qualified stackups for related products.
Reserve ENEPIG for mixed assembly; use ENIG/OSP elsewhere.
Early review catches over-constrained design rules.
Rotate and gang boards to improve yield.
Define reliability testing frequency to avoid unnecessary costs.
Use common drill/lamination tooling to reduce NRE.
Group backdrill depths to minimize machine time.
Reserve low-loss materials for long programs.
Quality, environmental, and industry credentials supporting reliable manufacturing.
Quality management for multilayer fabrication.
Environmental controls for press, plating, and imaging.
Traceability for medical and instrumentation builds.
Automotive APQP/PPAP for high-layer control modules.
Aerospace governance across sequential lamination.
Performance classes for rigid and rigid-flex stackups.
Safety compliance for flame and dielectric metrics.
Hazardous substance compliance.
Quality & Cost Console
Unified dashboard connecting HDI quality checkpoints with the economic levers that compress cost.
Process & Reliability
Stack-Up Validation
Pre-Lamination Strategy
• Rotate outlines, mirror flex tails
• Share coupons across programs
• Reclaim 5-8% panel area
Registration
Registration
Laser Metrology
• Online laser capture
• ±0.05 mm tolerance band
• Auto-logged to SPC
Testing
Testing
Electrical Test
• TDR coupons per panel
• IPC-6013 Class 3
• Force-resistance drift logged
Integration
Integration
Assembly Controls
• Nitrogen reflow
• Inline plasma clean
• 48h logistics consolidation
Architecture
Architecture
Cost Strategy
• Balance cost vs performance
• Standardize on common cores
• Low-loss only on RF layers
Microvia Planning
Microvia Planning
Via Cost Savings
• Avoid stacked microvias
• Share backdrill tools
• Minimize fill costs
Utilization
Utilization
Panel Optimization
• Rotate for nesting efficiency
• Share test coupons
• Standardize tooling
Execution
Execution
Supply Chain Levers
• Pool low-loss material
• Dual-source laminates
• Match finish to need
Send stackups, panel drawings, and impedance goals—we reply with DFx notes, cost, and timeline within one business day.
Answers on layer counts, materials, and testing.
