Fabrication Processes for Every Technology

High-Precision PCB Manufacturing

At the heart of every cutting-edge electronic product lies a high-performance PCB. We specialize in a broad range of PCB types, including Multilayer, HDI, Rigid-Flex, and Ceramic boards, designed to meet the most demanding requirements.

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Tailored Manufacturing for Your Unique Project

Our PCB manufacturing processes are meticulously crafted to match your precise project needs. Whether you're looking for High-Density Interconnect (HDI) boards, gold fingers, ceramic PCBs, or metal core boards, our team ensures that every product we create meets the highest standards of quality, performance, and reliability, while adhering to your timeline and budget constraints.

Fabrication Processes by Technology

Detailed process flows for our diverse PCB capabilities.

Multilayer PCB + Resin Plug (POFV / VIPPO)

For designs requiring Via-in-Pad for BGAs or high-pressure vacuum air-tightness.

•Cut Laminate → Baking → Inner Layer Dry Film → Etching → AOI → Brown Oxide
•Lamination → X-Ray Drilling → Drill 1 (Buried Vias) → Desmear → PTH
•Panel Plating 1 → Resin Plugging → Baking → Planarization
•Drill 2 (Through Holes) → Desmear → Cap Plating → Pattern Plating
•Outer Layer Etching → AOI → Solder Mask → Surface Finish → Routing → E-Test

HDI Type I Process (1+N+1)

Smartphones, consumer electronics using Laser Blind Vias.

•Core Fabrication: Cut Laminate → Inner Layer Dry Film → Etching → AOI → Brown Oxide
•Build-up: Lamination → Laser Drilling (Blind Vias) → Mechanical Drilling (TH)
•Plasma Desmear → Electroless Copper → VCP Plating (Blind Via Filling)
•Outer Layer Dry Film → Pattern Plating → Etching → AOI → Solder Mask → Finish

HDI Type II Process (2+N+2)

Tablets, 5G Modules, High-density logic boards. Involves two build-up cycles.

•Core Fabrication: Standard Inner Layer Process
•1st Build-up: Lamination → Laser Drill 1 → Mech Drill (Buried) → VCP Plating → Patterning
•2nd Build-up: Lamination 2 → X-Ray Drill → Laser Drill 2 → Mech Drill (TH)
•Plasma Desmear → VCP Plating → Outer Layer Patterning → Solder Mask → Finish

Rigid-Flex PCB Process

Wearables, Aerospace, Medical devices. Complex hybrid lamination.

•Flex Core: Cut FCCL → Dry Film → Etching → AOI → Coverlay Lamination → Curing
•Rigid Prep: Mill No-Flow Prepreg → Stack-up (Rigid + PP + FPC + PP + Rigid) → Vacuum Lamination
•Laser Trimming → Drilling → Plasma Cleaning → Plating → Outer Layer Patterning
•Laser Opening (Remove Rigid Cap) → Controlled Depth Routing

Metal Core PCB (MCPCB)

LED Lighting, Power Modules. Single-sided aluminum or copper base.

•Cut Aluminum Laminate → Scrubbing → Dry Film → Acid Etching → Strip Film
•Solder Mask (High Reflectivity White Ink) → Legend → Surface Finish (HASL/OSP)
•Hi-Pot Test (High Voltage Insulation) → Profiling (V-Cut/CNC) → Cleaning

Embedded Components

RF Backplanes, High-frequency signals with embedded resistors/capacitors.

•Cut Laminate (Resistive Layer) → Inner Layer Dry Film → 1st Etching (Remove Copper)
•2nd Etching (Remove Resistive Material) → Laser Trimming (Adjust Value)
•Inner Layer AOI → Brown Oxide → Lamination → Standard Plating Process

Gold Finger PCB

Edge Connectors for PCIe, DDR slots.

•Standard Fabrication → Solder Mask (Open at Finger area)
•Lead Generation → Blue Glue/Tape Application → Electroplated Nickel
•Electroplated Hard Gold (30-50u") → Remove Tape → Surface Finish (Rest of board)
•Beveling (Chamfering 30°/45°) → Mill Leads

Selective / Segmented Hard Gold

Keypads, Contact points on the middle of the board.

•Standard Fabrication → Solder Mask → 1st Dry Film/Taping (Protect non-gold areas)
•Selective Electroplated Ni/Au (On Contacts) → Remove Film
•2nd Surface Finish (ENIG/OSP on SMT Pads) → Legend → Profiling

Ceramic PCB - DPC Process

Direct Plated Copper for High-power LED, RF Precision modules.

•Ceramic Cleaning → Vacuum Sputtering (Ti + Cu Seed) → Dry Film
•Pattern Plating (Thicken Copper) → Strip Film → Flash Etching
•Grinding/Polishing → Solder Mask → Surface Finish → Laser Dicing

Ceramic PCB - DBC Process

Direct Bonded Copper for IGBT Modules, High Voltage Power.

•Ceramic Cleaning → Copper Foil Placement (OFC Copper)
•High-Temp Eutectic Bonding (1065°C) → Patterning (Etch) → Strip Film
•Electroless Nickel/Gold (or Ag) → Solder Mask → Laser/Mechanical Singulation

Carbon Ink PCB

Remote Controls, Calculators, Keypads.

•Standard Process → Outer Layer Etching → Solder Mask
•Carbon Ink Printing (Screen Printing) → Curing (High Temp Baking)
•Surface Finish (OSP, avoid Carbon area) → Carbon Resistance Test

Embedded Coin PCB

High Power Dissipation (e.g., 5G Base Stations).

•Inner Layer Core Cut → Inner Layer Routing (Cavity Milling)
•Copper Coin Preparation → Pressing (Insert Coin + High-Flow Prepreg)
•Planarization/Grinding (Leveling Coin and Resin) → Drilling → Standard Plating

Backdrill / Counterbore

High-Speed Signal Integrity (Stub Removal).

•Standard Pattern Plating → Etching → Backdrilling (Depth Controlled)
•E-Test (Verify Stub Removal) → Solder Mask → Surface Finish
•Counterbore Drilling → Profiling

Advanced Material Inventory

We maintain a strategic inventory of high-performance materials to support diverse industry needs. By partnering with world-class laminate manufacturers, we ensure material consistency and availability.

Standard & High-Tg FR4: Shengyi (S1000-2, S1170), Isola (370HR), Kingboard (KB-6167). Tg 130°C to 180°C+.
High-Frequency & Low-Loss: Rogers (RO4350B, RO3003), Taconic, Arlon.
Metal Base (IMS): Bergquist and Laird (1.0W/mK to 8.0W/mK).
Flexible Materials: DuPont and Panasonic Polyimide (PI).
Specialty Substrates: Halogen-free, High-CTI materials.

Pre-Production Engineering and DFM

Our experienced CAM engineers perform a comprehensive Design for Manufacturing (DFM) review to minimize risks and improve yield.

Data Verification: Gerber RS-274X, ODB++, DXF. Auto-check for integrity.
DRC (Design Rule Check): Scanning for min trace/space, annular ring, drill-to-copper.
Netlist Comparison: IPC-356 vs Gerber to prevent electrical opens/shorts.
Signal Integrity Simulation: Polarcale stack-up simulation for impedance control.
Panelization Optimization: Efficient array layouts (V-cut/Tab-routing) for assembly.

Need Expert Consultation?

For complex designs or specialized PCB requirements, our experts are ready to offer in-depth consultations.

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Frequently Asked Questions

Answers to the questions we hear most from hardware teams.

What information do you need to start?

Gerber/ODB++, drill files, stackup or impedance targets, finish, mask/legend colors, and panel notes.

How are impedance requirements handled?

We solve line widths from your targets, build coupons, and TDR test to verify before release.

Can you expedite prototypes?

Yes—quick-turn slots are available depending on layer count, materials, and finish; ask for available windows.

How is quality verified?

AOI, electrical test, coupon cross-sectioning, and final visual per IPC Class II/III as requested.

Do you support DFM feedback?

Yes—panelization, drill tolerances, spacing, and finish suggestions are provided during CAM review.