Loss & Phase Stability
Df 0.0009–0.004 and stable Dk keep S21 and phase error in check for 6–86 GHz RF chains.
- RO4000™ for sub-30 GHz hybrids
- RO3000™ / RT/duroid® for mmWave/space
- CLTE/CLTE-XT for low PIM phased arrays
Materials
Rogers High-Frequency PCB Manufacturing Services
At APTPCB, we transform high-performance Rogers laminates into precisely manufactured printed circuit boards. We are a specialized PCB Manufacturing and Assembly Factory, partnering directly with Rogers Corporation to source genuine materials for your high-frequency designs.
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When to Deploy Rogers Materials
Hybrid Cost Strategy
Rogers on RF layers, FR-4/BT on digital planes cuts BOM 30–50% vs all-PTFE, matching Our hybrid guidance.
- Bondply 4450F / fastRise® selection
- Plane-split diagrams and keep-outs
- Hybrid lamination curves logged
Integration & Validation
Combines with smooth copper, spread glass, and mmWave launches; VNA/TDR datasets ship with every lot.
- Huray-modeled stackups
- TDR ±5% acceptance
- VNA 40 GHz + phase match logs
Comprehensive Rogers Material Series & Models Support
We support the complete Rogers portfolio below—each row summarizes when to deploy it and the exact models stocked or co-sourced.
| Series & Composition | Key Traits / Use Cases | Representative Models |
|---|---|---|
| 1. RO4000® Series (Hydrocarbon Ceramic) | FR-4-compatible processing, low-loss telecom/antenna work, cost-efficient hybrids. | • RO4350B – base-station PAs & RF front-ends • RO4003C – halogen-free impedance control • RO4835 / RO4835T – oxidation-resistant • RO4450F / RO4450T – multilayer prepregs • RO4360G2 – Dk 6.15 for miniaturization • RO4500 / RO4700 – automotive & antenna builds • RO4000® LoPro® – low-profile copper for lower IL/PIM |
| 2. RO3000® Series (PTFE + Ceramic Filler) | Stable Dk over temperature, automotive radar, mmWave links, balanced hybrids. | • RO3003 / RO3003G2 – 77 GHz radar & ADAS • RO3006 – Dk 6.15 for PAs • RO3010 – Dk 10.2 for aggressive size cuts • RO3035 – ultra low-loss Dk 3.5 • RO3200 Series – woven-glass reinforced |
| 3. RT/duroid® Series (PTFE Composites) | Ultra-low electrical loss, aerospace/defense grade, space-qualified options. | • RT/duroid 5880 / 5880LZ – Dk 2.20 / 1.96 mmWave • RT/duroid 6002 – dimensional stability • RT/duroid 6006 / 6010LM – high-Dk filters • RT/duroid 6202 / 6202PR – robust multilayers • RT/duroid 5870 – glass microfiber reinforced |
| 4. TMM® Series (Thermoset Microwave) | Wire-bondable, ceramic-like Dk accuracy with easier processing and copper-matched CTE. | • TMM 3 / 4 / 6 / 10 / 10i / 13i – Dk 3.27–12.85 span • Copper-matched expansion for reliable PTHs |
| 5. Specialty & Legacy Series | Thermal-led or legacy defense programs needing specific mechanical or heritage specs. | • TC Series (TC350, TC600) – up to 1.1 W/m·K • AD Series – commercial PTFE/glass • CLTE Series – micro-dispersed ceramic PTFE • CuClad® / IsoClad® – legacy aerospace/defense |
Key Material Properties (Engineering Reference)
Selecting the right material is critical. Below are typical values for the most frequently requested materials in our factory.
| Material Model | Dielectric Constant (Dk) @ 10 GHz | Dissipation Factor (Df) | Thermal Conductivity (W/m/K) |
|---|---|---|---|
| RO4350B | 3.48 ±0.05 | 0.0037 | 0.62 |
| RO4003C | 3.38 ±0.05 | 0.0027 | 0.71 |
| RO4835 | 3.48 ± 0.05 | 0.0037 | 0.66 |
| RO3003 | 3.00 ± 0.04 | 0.0010 | 0.50 |
| RO3006 | 6.15 ± 0.15 | 0.0020 | 0.79 |
| RT/duroid 5880 | 2.20 ± 0.02 | 0.0009 | 0.20 |
| RT/duroid 6002 | 2.94 ± 0.04 | 0.0012 | 0.60 |
| TC350 | 3.50 ± 0.05 | 0.0020 | 1.0 |
Note: Values are for reference only. For precise Impedance Control calculations, please consult the official Rogers datasheet or our CAM engineers.
Reference Stackups from our team
6-Layer Hybrid (RO4350B + FR-4)
Microstrip RF outers, FR-4 digital core, adhesives logged.
- SE 50 Ω microstrip with mask keepouts
- Diff 85/100 Ω stripline in FR-4
- Bondply 4450F press recipe
4-Layer RO4003C RF Core
Pure Rogers stack for compact RF front ends.
- Maskless RF traces, enamel protection
- SMPM launch notes included
- VNA coupon references
8-Layer mmWave Hybrid
Dual RO4835 outers + FR-4 support layers for control sections.
- Backdrill plan + VLP copper callouts
- Phase match logs appended
- Ready for phased-arrays
Rogers-Focused Fabrication Capabilities
We treat Rogers laminates differently from standard FR-4. Our facility is equipped with specific protocols:
1. PTFE Plasma Treatment (Desmear)
Materials like RO3000 and RT/duroid are chemically inert. Standard chemical desmear fails to work on them. We utilize Plasma Etching to activate the hole walls before copper plating, ensuring reliable connectivity and preventing barrel cracks.
2. Hybrid Stack-Ups (Cost Optimization)
We are experts in Hybrid PCBs. We can combine RF Layers (Rogers cores) with Non-RF Layers (Spread Glass FR-4) for mechanical structure and power distribution. This offers significant cost reduction while maintaining RF performance.
3. Controlled Impedance & RF Finishes
Precision Etching maintains trace width tolerance within ±0.5mil to ensure 50Ω/100Ω impedance. We recommend Immersion Silver or ENIG for the best RF conductivity and flatness.
4. Material Storage
Rogers materials are sensitive to moisture. We store all laminates in humidity-controlled environments and follow strict baking cycles before lamination to prevent delamination.
Application Snapshots
5G Remote Radio / Base Station
RO4350B + FR-4 hybrids for massive-MIMO arrays.
- Phase match ±1° per tile
- Selective ENIG soft gold for RF pads
- Panel coupons for field swap
Automotive Radar (77 GHz)
RT/duroid 5880/CLTE modules with cavity machined lenses.
- Lens/cavity ±50 µm control
- Moisture bake + conformal coat prep
- Environmental logs (−40↔125 °C)
Satcom Payload / Aerospace
RO3003/4835 + aluminum backers for low PIM and thermal stability.
- Thermal strap integration
- Selective finish for connectors
- PIM/VSWR measurement pack
RF / Rogers Material Portfolio material prompts
Checklist we run through before locking a RF / Rogers Material Portfolio stack.
RF corridors
Capture band, power density, and impedance so we can map to the right laminate and bondply.
- Connector/launch type
- Mask & plating needs
Hybrid planning
Pair the ${brand} core with FR-4, copper coins, and fastRise®-style bondply to manage CTE.
- Press profile alignment
- Cavity / stiffener notes
Validation
Build coupon stackups plus ESS/thermal plans before release to volume.
- Coupon impedance sims
- ESS prompts
Frequently Asked Questions
Do you have specific Rogers materials in stock (e.g., RO4350B 20mil)?
We maintain a strategic stock of popular models like RO4350B, RO4003C, and RO3003 in common thicknesses. For less common models (certain RT/duroid or TMM series), we have a rapid procurement channel with Rogers distributors. Please specify the Model + Thickness in your quote request.
Is Rogers PCB much more expensive than FR-4?
Yes, the raw material cost is higher. However, we can optimize costs. RO4000 Series is moderately priced. PTFE (RO3000/RT/duroid) has higher cost due to material price and complex processing (Plasma). Tip: Ask our engineers about a Hybrid Stack-up (Rogers + FR4) to lower the total board cost.
Can you manufacture Multilayer Rogers PCBs?
Absolutely. We regularly produce 4-12 Layer RO4000 series boards (using RO4450 prepreg), Multilayer Radar boards using RO3000 series, and High-layer count Hybrid boards. The stack-up design is critical. Our engineering team can help you select the correct bonding materials.
Can you help me choose the right material?
If you provide your requirements (Operating Frequency, Power Level, Size Constraints, and Application), we can recommend suitable Rogers materials. However, final verification usually requires your RF simulation.