Up to 32 Layers / HDI / Fine Pitch
Rigid-flex PCB Manufacturing Capabilities
Rigid-flex PCB solutions for automotive, industrial, medical, aerospace, and high-end consumer products-combining flexible interconnects with robust rigid sections under one manufacturable stack-up.
Get an Instant Quote
Rigid-flex PCB Manufacturing Capabilities - APTPCB
APTPCB is a professional PCB manufacturer and assembler, specializing in high-quality rigid-flex PCB solutions. We enable compact, reliable 3D electronic integration for demanding applications such as automotive electronics, industrial control, medical devices, aerospace & defense, and high-end consumer products. Our integrated approach ensures both mechanical flexibility and exceptional reliability.
We offer comprehensive engineering support from concept to production. We can work with all common PCB engineering data formats, including native design files from mainstream EDA tools like Altium Designer, Cadence Allegro (OrCAD), Mentor Xpedition (PADS), and KiCad. For mass production, we strongly recommend providing standard Gerber and drill files (along with ODB++ or IPC-2581 data) as the final manufacturing package to ensure maximum accuracy and efficiency.
Why Choose APTPCB for Your Rigid-flex Projects?
Rigid-flex PCBs represent the pinnacle of electronic packaging, allowing seamless, three-dimensional interconnection of rigid component areas with flexible sections for dynamic bending and intricate routing. This technology significantly reduces assembly steps, saves critical space, improves signal integrity, and enhances long-term reliability in environments subject to vibration and shock, eliminating the need for traditional cables and connectors.
At APTPCB, our engineering team possesses deep expertise in rigid-flex design complexities. We collaborate with you from the early stages to evaluate critical factors such as bending radius, copper balancing in transition zones, material selection, stiffener design, stack-up optimization, and dynamic flex life requirements. We help you transform your mechanical concept and schematic into a robust, manufacturable rigid-flex stack-up that precisely fits your application's spatial, electrical, and reliability targets.
Rigid-flex PCB Manufacturing & Assembly Capabilities
| Item | Capability |
|---|---|
| Max Layer Count (Overall) | Up to 32 Layers |
| Min Layer Count (Overall) | 1 Layer Flex + 1 Layer Rigid (2L overall) |
| Inner Layer Min Trace/Space | 2.5 / 2.5 mil (0.0635 mm) |
| Out Layer Min Trace/Space | 2.5 / 2.5 mil (0.0635 mm) |
| Inner Layer Max Copper | 3 oz (105 µm) - up to 10 oz in specific rigid areas |
| Out Layer Max Copper | 3 oz (105 µm) - up to 10 oz in specific rigid areas |
| Min Flex Core Thickness | 0.001 (0.025 mm) for adhesiveless polyimide film |
| Min Finished Mechanical Drill | 0.0079 (0.20 mm) |
| Min Finished Laser Drill (Microvia) | 0.003 (0.075 mm) for HDI and fine-pitch applications |
| Min Finished Hole Size | 0.006 (0.15 mm) |
| Max Mechanical Drill Aspect Ratio | 12 : 1 (up to 15:1 consult us) |
| Max Blind Via Aspect Ratio | 0.75 : 1 |
| Max Laser Drill Aspect Ratio | 1 : 1 (microvias) |
| Press Fit Hole Tolerance | ±0.05 mm |
| PTH Tolerance | ±0.075 mm |
| NPTH Tolerance | ±0.05 mm |
| Countersink Tolerance | ±0.15 mm |
| Board Thickness (Overall) | 0.4 - 3.2 mm (rigid + flex) |
| Board Thickness Tolerance (< 1.0 mm) | ±0.10 mm |
| Board Thickness Tolerance (≥ 1.0 mm) | ±10% |
| Impedance Tolerance - Single-Ended | ±5 Ω (≤ 50 Ω), ±7% (> 50 Ω) |
| Impedance Tolerance - Differential | ±5 Ω (≤ 50 Ω), ±7% (> 50 Ω) |
| Min Board Size | 5 × 5 mm (panelized) |
| Max Panel Size | 18 × 24 inch (457 × 610 mm) |
| Contour Tolerance | ±0.08 mm (tighter with laser cutting) |
| Min BGA Pitch | 0.3 mm (12 mil) in rigid areas |
| Min SMT Component Size | 01005 (0.4 × 0.2 mm) in rigid areas |
| Surface Finishes | ENIG, Gold Finger (Hard Gold), Immersion Silver, Immersion Tin, Lead-free HASL (rigid areas), OSP, ENEPIG, Flash Gold |
| Gold Fingers / Contact Pads | Bevel 30° / 45°, controlled hard-gold thickness, chamfered edge |
| Solder Mask Colors | Green, Black, Blue, Red, Matte Green (others on request) |
| Min Solder Mask Clearance | 1.5 mil (0.038 mm) |
| Min Solder Mask Dam | 3 mil (0.076 mm) |
| Legend (Silkscreen) Colors | White, Black, Red, Yellow (others on request) |
| Min Legend Width / Height | 3.5 / 20 mil (0.089 / 0.508 mm) |
| Strain Relief Fillet Width | 1.5 ± 0.5 mm |
| Bow & Twist | ≤ 0.5% (typical in rigid areas per IPC-A-600/6013) |
| Via Types | Through-hole, Blind Vias, Buried Vias, Microvias (Laser Drilled), Via-in-Pad (VIP) |
| Filled Vias | Conductive filled (e.g., copper-filled) and non-conductive filled |
| Sequential Laminations | Up to 2 sequential laminations |
| Design Rule Check (DRC) | Comprehensive DFM review by our engineering team |
| Electrical Test | 100% E-test (Flying Probe or Fixture Test) |
| Quality Standards | IPC-A-600 Class 2 / Class 3 |
| Certifications | ISO 9001:2015, UL Certified; RoHS compliant; IATF 16949 and REACH on request |
| Production Types | Prototypes, Small/Medium Batches, Volume Production |
| Typical Lead Time | 7-20 working days (quick-turn available) |
Comprehensive Rigid-flex PCB Assembly Services
| Item | Capability | Notes |
|---|---|---|
| Min SMT Component Size | 01005 (0.4 × 0.2 mm) | High-density placement in rigid areas |
| Min BGA / CSP Pitch | 0.3 mm (12 mil) | Accurate placement for fine-pitch packages |
| Max Component Height | Up to 25 mm (top/bottom side) | Fits varied component profiles |
| Assembly Technologies | SMT, THT, Mixed Assembly | Full range of assembly options |
| Soldering Processes | Lead-free Reflow, Wave (THT rigid areas), Selective Soldering | Optimized by component type |
| Inspection & Testing | AOI, X-Ray, ICT, FCT | Quality assurance |
| Conformal Coating | Available on request | Environmental protection |
| Component Sourcing | Full Turnkey (Procurement & Assembly) | Streamlined supply chain |
Partner with APTPCB for Expert Rigid-flex Development
Rigid-flex designs are deeply intertwined with mechanical enclosures, thermal management, and final product assembly. Partnering with APTPCB early in your development cycle is crucial to mitigating risks and accelerating your time-to-market.
Share your 3D models, mechanical constraints, expected bend angles, and lifetime requirements with us. Our engineering team will provide invaluable support by:
- Optimizing Material Selection & Stack-up Design: Choosing suitable polyimide thicknesses, adhesive types, and copper foils (RA vs. ED copper) for both rigid and flexible areas.
- Defining Safe Bend Areas & Radii: Ensuring optimal flexure without compromising reliability.
- Designing for Controlled Impedance: Achieving precise signal integrity in all regions.
- Proposing Stiffener & Connector Solutions: Tailoring designs for robust assembly and performance.
- Conducting DFM & DFA Reviews: Identifying potential manufacturing and assembly challenges proactively.
This collaborative approach transforms your vision into a manufacturable, high-performance, and cost-effective rigid-flex PCB, reducing redesign cycles and ensuring long-term product reliability.
Frequently Asked Questions
What are your core rigid-flex manufacturing limits?
Up to 32 layers overall, flex cores as thin as 0.025 mm, 2.5/2.5 mil trace/space, laser microvias to 0.075 mm, and board sizes up to 18×24 inch panels.
Can you handle HDI and fine-pitch BGAs on rigid-flex?
Yes-HDI with microvias and via-in-pad plus BGA/CSP down to 0.3 mm pitch and 01005 components on rigid areas.
Which materials and finishes are available?
Adhesiveless polyimide flex cores, FR-4 rigid sections, heavy copper options, solder mask colors, and finishes including ENIG, ENEPIG, OSP, Immersion Silver/Tin, LF-HASL, and hard gold fingers.
Do you support impedance control and testing?
Yes-impedance coupons with ±5 Ω/±7% tolerance targets, 100% E-test, and IPC-A-600/6013 Class 2/3 compliance.
How early should we engage for rigid-flex design?
Engage at concept/stack-up stage to define bend radii, copper balancing, stiffeners, impedance, and connector strategy; we provide DFM/DFA and material recommendations.
Request Rigid-flex PCB Support
Share your stack-up, bend requirements, and materials-we will provide DFM guidance, feasibility, and lead times for your rigid-flex build.