High-Temperature & RF Materials

Arlon PCB Laminates & Bondply Manufacturing

From 33N/35N polyimide for avionics burn-in boards operating at +260 °C to CLTE-XT microwave substrates for low-PIM phased arrays, APTPCB fabricates the complete Arlon/AGC portfolio with controlled press profiles, hybrid stack-up engineering, and RF/environmental validation deliverables. We stock the most commonly specified Arlon grades, including 33N, 35N, 85N polyimide and 45N/47N epoxy laminates, Thermount aramid-reinforced substrates, and CLTE-XT/TC350 microwave materials, and maintain validated lamination recipes for every product family.

Polyimide + PTFE

Dual Chemistry

-55 -> +260 °C

Operating Range

Hybrid Ready

Multi-Material Stacks

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33N / 35N / 85NPolyimide Series

45N / 47N / 49NEpoxy Series

CLTE-XT / TC350Microwave PTFE

ThermountAramid Reinforced

TDR / VNAValidated

ISO 9001Certified

IPC-6012 CL3Acceptance

MIL-SpecDocumentation

33N / 35N / 85NPolyimide Series

45N / 47N / 49NEpoxy Series

CLTE-XT / TC350Microwave PTFE

ThermountAramid Reinforced

TDR / VNAValidated

ISO 9001Certified

IPC-6012 CL3Acceptance

MIL-SpecDocumentation

Why Engineers Specify Arlon

Arlon by AGC — Polyimide and Microwave PTFE Under One Portfolio

Arlon, now part of AGC Inc., manufactures a broad range of specialty PCB laminates spanning two fundamentally different material categories: high-temperature polyimide substrates for aerospace, military, and industrial electronics that must survive extreme thermal environments, and low-loss PTFE/ceramic microwave substrates (the CLTE and TC350 families) for RF and phased-array applications. This dual capability makes Arlon unique: it is one of the few laminate suppliers that can serve both avionics burn-in boards requiring 260 °C continuous operation and low-PIM antenna panels demanding sub-0.002 dissipation factor at microwave frequencies.

APTPCB maintains validated fabrication processes for the full Arlon portfolio. Our polyimide processing includes controlled press profiles with proper dwell temperatures to achieve full cure without warpage, strict moisture-control baking protocols, and compatibility with both ENIG and hard gold surface finishes for connector areas. Our CLTE-XT microwave processing applies the same rigorous plasma desmear and hybrid stack-up engineering used for other high-frequency PCB builds. Stock of 33N, 35N, 45N, 47N, and CLTE-XT in common thicknesses enables production starts without procurement delays for the most frequently specified Arlon grades.

Arlon polyimide laminate cross-section under an optical microscope

Material Portfolio

Arlon Series & Models We Process

Our factory holds validated processing recipes for every product listed below. Each series has documented drill programs, etch parameters, lamination profiles, and quality acceptance criteria in our production database.

Series	Base Chemistry	Dk Range	Df (Typ.)	Key Characteristics	Primary Applications
33N / 35N / 85N	Polyimide Resin	4.2 - 4.3	0.015	The industry benchmark for extreme temperature survival. Polyimide resins offer exceptional thermal stability with Tg >250°C and very low Z-axis expansion. Unlike PTFE, polyimide processes with standard FR-4 desmear chemistry (no plasma required). Highly hygroscopic, strict baking required before lamination and reflow.	Commercial/Military avionics, downhole drilling (MWD/LWD) boards, extreme-temp burn-in boards, engine control modules
45N / 47N / 49N	Multifunctional Epoxy	4.3 - 4.4	0.015	High-reliability, high-Tg (175°C - 200°C) epoxy systems designed to bridge the gap between standard FR-4 and pure polyimide. Excellent resistance to CAF and lead-free assembly temperatures. Processes entirely with standard PCB manufacturing workflows.	High-layer-count digital backplanes, military and commercial aerospace communications, demanding industrial controls
Thermount (55NT/85NT)	Polyimide / Non-woven Aramid	3.5 - 4.0	0.017	Uses non-woven aramid reinforcement instead of traditional glass fiber. Provides a very low in-plane CTE and is significantly lighter than standard polyimide. Eliminates glass-weave skew for high-speed signals. Requires specialized routing and drilling to prevent aramid fiber tear.	Surface mount military boards with ceramic LCC packages, space-constrained avionics where weight is critical, dense multilayer designs
CLTE-XT / CLTE-AT	PTFE / Ceramic / Woven Glass	2.94 - 3.00	0.0012	Commercial microwave laminate with extremely low loss and a Z-axis CTE perfectly matched to copper for superior plated through-hole reliability in multilayer RF boards. Phase stable over temperature. Requires plasma desmear for via metallization.	Phased-array radar antennas, low-PIM cellular base station feeds, collision avoidance radar, space communications
TC350 / TC600	PTFE / Woven Glass / Ceramic	3.50 - 6.15	0.0020	Thermally enhanced microwave laminates offering exceptional thermal conductivity (1.0 W/m·K for TC350) to pull heat away from active RF components. Maintains stable Dk and low loss. Requires plasma desmear.	High-power amplifiers (PA), tower-mounted amplifiers (TMA), GaN and GaAs device mounting, broadcast transmitters
AD250 / AD300 / AD1000	PTFE / Woven Glass / Ceramic	2.50 - 10.2	0.0014	Antenna-grade PTFE composites offering a wide range of dielectric constants. AD1000 (Dk 10.2) allows for extreme miniaturization of patch antennas and filters. Requires plasma desmear.	GPS/GNSS patch antennas, dielectric resonator antennas (DRA), miniaturized filters, broadband base station antennas
CuClad / DiClad / IsoClad	PTFE / Woven & Non-woven Glass	2.17 - 2.60	0.0009	Legacy PTFE materials that remain critical for mature military and aerospace programs. CuClad 217/DiClad 880 provide the absolute lowest dielectric loss. Requires plasma desmear.	Legacy military radar systems, EW receivers, specialized low-loss stripline networks, VNA test fixtures
37N / 38N / HF-50	Bondply & Prepreg Systems	-	-	Low-flow polyimide prepregs (37N) and specialized microwave bondplys (HF-50). Essential for hybrid stack-ups, rigid-flex bonding, and attaching metal cores (heatsinks) to RF sub-assemblies.	Hybrid PTFE/FR-4 lamination, rigid-flex interfaces, metal-backed power amplifier boards

33N (10-60 mil), 45N (5-31 mil), and CLTE-XT (10-60 mil) are stocked at APTPCB with 1/2 oz and 1 oz ED copper cladding. Other series and non-standard thicknesses are available from Arlon authorized distributors within 5-10 working days.

Engineering Reference

Detailed Electrical & Mechanical Properties

Comprehensive material data for the most frequently requested Arlon models. Data sourced from manufacturer published datasheets.

Property	33N (Polyimide)	45N (Epoxy)	55NT (Thermount)	CLTE-XT (PTFE)	TC350 (PTFE)	AD250 (PTFE)	Test Method
Dk (Dielectric Const.)	4.20 @ 1 MHz	4.30 @ 1 MHz	3.50 @ 1 MHz	2.94 @ 10 GHz	3.50 @ 10 GHz	2.50 @ 10 GHz	IPC-TM-650
Df (Loss Tangent)	0.015 @ 1 MHz	0.015 @ 1 MHz	0.017 @ 1 MHz	0.0012 @ 10 GHz	0.0020 @ 10 GHz	0.0014 @ 10 GHz	IPC-TM-650
Thermal Cond. (W/m·K)	0.20	0.25	0.15	0.45	1.00	0.22	ASTM E1461
CTE X/Y (ppm/°C)	14 / 14	14 / 14	7 / 9	8 / 8	8 / 8	24 / 24	IPC-TM-650 2.4.41
CTE Z (ppm/°C)	45	45	40	20	10	190	IPC-TM-650 2.4.41
Moisture Absorption (%)	1.20	0.15	1.00	0.02	0.02	0.02	IPC-TM-650 2.6.2.1
Peel Strength (lb/in)	8.0	9.0	6.0	8.0	8.0	12.0	IPC-TM-650 2.4.8
Tg (°C, DSC)	>250	175	260	N/A (PTFE)	N/A (PTFE)	N/A (PTFE)	IPC-TM-650 2.4.25
Dielectric Strength (V/mil)	1200	1200	1000	600	600	800	IPC-TM-650 2.5.6.2
Flammability (UL 94)	V-0	V-0	V-0	V-0	V-0	V-0	UL 94
Plasma Desmear Required	No (Standard)	No (Standard)	No (Standard)	Yes	Yes	Yes	-

Polyimide materials (33N, 55NT) have significant moisture absorption rates compared to PTFE or standard FR-4. A strict pre-bake is mandatory before lamination and assembly to prevent delamination. PTFE materials (CLTE, TC350, AD) have no meaningful Tg and require plasma desmear.

Polyimide vs. High-Tg Epoxy

Head-to-Head: Arlon 33N Polyimide vs. Standard High-Tg FR-4

When designing for harsh environments, engineers must choose between premium polyimide and advanced high-Tg epoxy. Here is why 33N is specified when FR-4 reaches its limits, and when an advanced Isola epoxy platform may still be the better economic fit.

Property	Arlon 33N (Polyimide)	High-Tg FR-4 (e.g., 370HR)	Comparison & Impact
Glass Transition (Tg)	>250 °C	180 °C	33N survives extreme environments where FR-4 softens and fails.
Operating Temp (MOT)	160 °C+ continuous	130 °C continuous	Polyimide dominates in burn-in boards and downhole drilling electronics.
Z-axis CTE (Below Tg)	45 ppm/°C	45 ppm/°C	Comparable at room temperature, but 33N maintains this stability to a much higher temperature.
Z-axis Expansion (50-260°C)	1.2%	>3.0%	33N prevents plated through-hole barrel cracking during extreme heat cycles.
Moisture Absorption	1.20%	0.15%	FR-4 is much more stable in high humidity; polyimide requires mandatory baking.
Desmear Process	Standard Chemistry	Standard Chemistry	Both use standard PCB wet processing (no plasma required).
Cost Position	Premium Material	Baseline	33N is utilized specifically when thermal survival outweighs raw material costs.

For military aerospace and deep-well drilling tools, 33N polyimide provides irreplaceable reliability. For standard commercial applications, high-Tg FR-4 or Arlon 45N epoxy is usually sufficient.

Manufacturing Process

Specialized Fabrication Workflows for Arlon Substrates

Processing Arlon materials requires equipment, chemistry, and process knowledge that go beyond standard FR-4 manufacturing. Whether managing the extreme pressing temperatures of polyimide or the plasma activation of microwave PTFE, our factory addresses every critical step.

Every production lot follows documented procedures with real-time parameter monitoring. Process data including drill speeds, etch chemistry concentrations, lamination temperatures, plating bath composition, and inspection results are archived per lot number for full traceability and continuous improvement analysis.

Our CAM engineering team reviews every incoming design for manufacturability before production begins, providing DFM feedback, impedance simulation data (Polar Si9000 with manufacturer Dk/Df curves), stack-up optimization recommendations, and material selection guidance at no additional charge. This front-end investment reduces production risk and ensures boards are built right the first time.

Hybrid CLTE-XT and FR-4 stack-up micrograph

Reference Stack-Ups

Common Arlon Stack-Up Configurations

Representative configurations with validated press profiles and established supply chains. Custom configurations welcome — contact our engineering team with your specific requirements.

Configuration	Layers	Signal Cores	Structural	Bonding System	Applications
Pure 33N Polyimide	4-12	33N all layers	-	37N / 38N prepreg	Avionics burn-in boards, downhole drilling (MWD), extreme temp sensors
CLTE-XT Hybrid	4-8	CLTE-XT (signal layers)	FR-4 / 45N	Low-loss prepreg	SATCOM transceivers, phased-array panels with digital control and power
TC350 + Metal Core	2-4	TC350 (signal)	Aluminum/Copper	Thermal adhesive	High-power PA boards requiring integrated heatsinks, broadcast modules
Thermount Multilayer	6-14	55NT all layers	-	55NT prepreg	Low-CTE military boards for LCC packages, space-constrained density
Pure 45N Epoxy	6-12	45N all layers	-	45N prepreg	High-reliability commercial aerospace, industrial control panels
Mixed Microwave PTFE	4-8	AD250 + CLTE-XT	-	Pure PTFE bondply	Multi-band EW receivers, complex RF manifolds
CuClad Radar Front-End	2-4	CuClad 217	-	HF-50 bondply	Legacy military radar, ultra-low-loss stripline networks
33N Rigid-Flex	4-8	33N (rigid)	Polyimide flex	Low-flow prepreg	Aerospace interconnects, military ruggedized assemblies

Fabrication Capabilities

Arlon-Specific Manufacturing Controls

Six core capabilities that differentiate our Arlon production from general-purpose PCB manufacturing for quality-critical PCB programs.

Polyimide Baking & Moisture Control

Arlon polyimide substrates (33N, 85N, 55NT) are highly hygroscopic, absorbing up to 1.2% moisture by weight. If not properly managed, this moisture will turn to steam during high-temperature lamination or solder reflow, instantly causing catastrophic delamination. We strictly enforce prolonged baking protocols in forced-air convection ovens prior to pressing and immediately before surface finish application. Incoming polyimide material is stored in our climate-controlled warehouse maintained below 45% relative humidity.

PTFE Plasma Desmear & Surface Activation

While Arlon polyimides process with standard chemistry, Arlon's microwave products (CLTE-XT, TC350, AD series, CuClad) are PTFE-based and chemically inert to standard alkaline permanganate. Our factory operates dedicated plasma treatment chambers using controlled O2/Ar gas mixtures to micro-roughen the PTFE hole wall surface before electroless copper seeding. This ensures reliable barrel plating adhesion that consistently passes IST thermal cycling per IPC-TM-650 2.6.26.

Modified Drilling for Aramid & PTFE

Different Arlon materials require drastically different drilling approaches. Thermount uses aramid fibers which are incredibly tough, while PTFE is a soft thermoplastic that can smear over inner copper layers. We use specialized routing bits and tuned feeds for aramid, and reduced spindle RPMs with optimized chip-load feed rates for PTFE.

High-Temperature Lamination Profiles

Arlon 33N and 85N polyimide materials require significantly higher pressing temperatures to achieve full cross-linking and cure compared to standard FR-4, often exceeding 215°C. We use high-temperature thermal oil lamination presses equipped with precision thermocouples to monitor actual board temperature at the center of the book.

Hybrid Stack-Up Engineering

Combining Arlon PTFE signal layers with FR-4 structural cores is a standard cost-saving practice, but it requires press profiles that satisfy both material systems simultaneously. Our CAM engineers balance the CTE mismatch between PTFE and FR-4 by designing symmetrical stack-ups, selecting appropriate low-loss bonding materials, and validating the full lamination cycle with test runs before volume production.

RF & Extreme-Environment Surface Finishes

For Arlon microwave PTFE boards, we recommend immersion silver for the lowest surface resistivity on RF signal traces. For Arlon polyimide boards headed into extreme environments, we apply high-reliability ENIG or Hard Gold for wear-resistant connector tabs. HASL is generally not recommended for either category due to thermal shock and surface roughness.

Quality & Validation

Documented Quality at Every Manufacturing Step

APTPCB operates under ISO 9001:2015 quality management systems and follows IPC-6012 Class 2 manufacturing controls for standard commercial orders, with full Class 3 process discipline available for aerospace, defense, and industrial high-reliability builds. Every Arlon PCB lot passes AOI at every inner and outer layer stage, electrical continuity testing, and dimensional verification of critical features under the same disciplined PCB quality framework used across our factory.

For controlled-impedance Arlon builds, we fabricate TDR coupons and record measured impedance values. For microwave products like CLTE-XT, TC350, and AD series, we can optionally perform VNA insertion-loss sweeps across customer-defined frequency bands (DC-40 GHz), archive cross-section micrographs, and provide IST results per IPC-TM-650 2.6.26. Additional optional deliverables include solder float testing, ionic cleanliness analysis, and full serialized traceability from incoming raw material lot to outgoing finished board panel.

For automotive programs, we follow IATF 16949 quality practices. For aerospace and defense programs, extended documentation packages including environmental test reports (thermal shock, moisture resistance, vibration), microsection micrographs, and serialized traceability from raw material lot through final shipping inspection are available per customer specification.

Vector network analyzer setup for Arlon RF validation

Industry Applications

Where Arlon PCBs Serve

Arlon substrates serve the most demanding applications across telecommunications, automotive, aerospace, defense, data center, medical, and industrial markets.

Aerospace & Defense

Military Avionics & Radar

AESA radar transmit/receive modules, electronic warfare receiver front ends, and engine control units rely on Arlon 33N and 85N polyimides for long-life reliability under extreme thermal cycling. Thermount 55NT is the standard where low CTE must match ceramic packages.

Telecommunications

5G & High-Power RF

Massive MIMO antenna panels and high-power amplifier pallets for 5G base stations use Arlon TC350 to pull heat away from active GaN and GaAs devices while maintaining excellent RF characteristics.

Satellite & Space

SATCOM & LEO Terminals

VSAT terminal RF front ends, LEO phased-array user terminals, GEO transponder boards, and earth station feed assemblies benefit from CLTE-XT's copper-matched CTE and legacy DiClad/CuClad low insertion loss.

Industrial

Downhole Drilling & MWD

Measurement While Drilling and Logging While Drilling tools experience ambient temperatures exceeding 175°C with intense vibration. Standard FR-4 fails catastrophically here. Arlon 33N polyimide is the bedrock material for continuous logic operation miles underground.

Automotive

ADAS Radar Systems

Short-range and long-range automotive radar sensor front ends for adaptive cruise control, blind-spot detection, and cross-traffic alert systems use AD300 and CLTE-MW for phase stability and tight dielectric tolerance.

Test & Measurement

Burn-in Boards & ATE

Automated Test Equipment and semiconductor burn-in boards rely on 33N polyimide to prevent fixture degradation, warpage, or pad adhesion loss over thousands of high-temperature stress cycles.

Material Selection Guide

How to Choose the Right Arlon Material for Your Design

The optimal Arlon laminate depends entirely on your primary environmental or electrical constraint: extreme heat, extreme power, dimensional stability, or ultra-low loss. Here is a practical selection framework based on our manufacturing experience with high-Tg PCB and RF builds.

Extreme Heat & Avionics (MOT > 150°C) — 33N / 85N Polyimide

If your PCB will be placed inside a jet engine compartment, used in deep oil-well drilling equipment, or serve as a semiconductor burn-in board undergoing repeated 200°C+ thermal cycles, standard FR-4 will delaminate and fail. Arlon 33N (and the premium 85N) polyimide is required. It features a Tg > 250°C and maintains structural integrity in environments where other plastics melt or soften.

High-Power RF & Thermal Management — TC350

For RF power amplifiers and tower-mounted amplifiers where active GaN components generate intense, concentrated heat, the substrate must act as a heat spreader. Arlon TC350 is specifically engineered for this, offering 1.0 W/m·K thermal conductivity while maintaining a microwave-friendly Dk of 3.50.

Microwave & Phased Arrays (Phase Stability) — CLTE-XT / CLTE-MW

For phased-array radar, satellite communications, and military RF where phase stability across temperature is critical, CLTE-XT is the benchmark. It is a PTFE material loaded with ceramic to closely match the X, Y, and Z-axis CTE of copper, producing reliable plated through-holes in complex high-layer-count RF boards.

Bare Die / LCC Packaging (Low CTE) — Thermount 55NT

When mounting large ceramic Leadless Chip Carriers directly to a PCB, the standard thermal expansion of glass-reinforced FR-4 will shear the solder joints as the board heats up. Thermount 55NT uses non-woven aramid fibers instead of glass, restricting in-plane expansion to better match the ceramic package while remaining significantly lighter than standard polyimide.

Cost-Effective High-Reliability — 45N Epoxy

If your design needs military-grade reliability and high layer counts but does not quite reach the extreme temperatures that mandate polyimide, Arlon 45N and 47N multifunctional epoxy are the ideal middle ground. They offer excellent CAF resistance, survive lead-free reflow easily, and are much cheaper and easier to process than pure polyimide.

FAQ

Arlon PCB Manufacturing FAQ

How does Arlon CLTE-XT compare to the Rogers RO3000 series?

Both Arlon CLTE-XT and the Rogers RO3000 series are ceramic-filled PTFE microwave laminates designed for low loss and excellent phase stability. CLTE-XT is engineered specifically to match the coefficient of thermal expansion of copper in all three axes, making it exceptionally reliable for complex multilayer RF boards where plated through-hole reliability during thermal cycling is the primary concern. Engineers making this comparison often also review Rogers RF laminate options before locking the final stack-up. Both materials require identical plasma desmear processing in our factory.

Is 33N polyimide required for all aerospace and military boards?

No. While 33N polyimide is the gold standard for extreme environments such as engine control units or high-friction areas, many aerospace and military boards operate in controlled or moderate environments. For these, Arlon 45N or 47N high-Tg epoxy is usually sufficient, much more cost-effective, and easier to manufacture. Polyimide should be specified strictly when the continuous operating temperature exceeds 150°C or when extreme thermal shock resistance is mandated by the MIL-spec requirements.

Which Arlon materials do you stock for immediate production start?

We stock the most highly demanded Arlon materials in our climate-controlled facility: 33N polyimide and 45N epoxy cores in 10, 20, 30, and 60 mil thicknesses, CLTE-XT microwave cores in standard thicknesses, and TC350 for thermal applications. Non-stocked items, including Thermount 55NT, legacy CuClad/DiClad, and specific low-flow prepregs, can be expedited from Arlon's authorized distribution network within five to ten working days depending on geographic region.

Can Arlon PTFE substrates be hybridized with standard FR-4?

Yes. Hybrid construction is very common. Arlon CLTE-XT or AD series signal layers can be bonded to FR-4 structural cores using compatible low-loss prepregs or bondplys. Our CAM engineers model impedance at every dielectric boundary, balance the CTE mismatch between the PTFE and FR-4 by designing symmetrical stack-ups, and validate the lamination press profile with thermocouple test runs.

What surface finishes do you recommend for Arlon boards?

For Arlon 33N polyimide boards used in harsh environments, we strongly recommend ENIG or Hard Gold, as these finishes withstand extreme heat without oxidizing and provide excellent wire-bonding capability. For Arlon microwave PTFE boards such as CLTE-XT, immersion silver is the default to minimize high-frequency skin-effect loss. HASL is not recommended for either category.

What are the typical lead times for Arlon PCB prototypes?

For builds using stocked materials such as 33N, 45N, and CLTE-XT, simple two-layer boards take 4-6 working days. Multilayer polyimide boards take 7-10 working days due to extended lamination baking cycles. PTFE-based builds also require 7-10 days due to plasma desmear and specialized drilling. If the specified Arlon model is not in inventory, add the material procurement lead time of 5-10 working days.

Do you offer turnkey PCBA assembly services for Arlon-based boards?

Yes. We provide full turnkey PCB assembly. For Arlon polyimide assemblies, the bare boards must undergo a prolonged moisture-elimination bake immediately before solder paste printing and reflow. Because polyimide is highly hygroscopic, skipping this step will cause trapped moisture to vaporize during reflow and result in delamination.

What quality certifications does your factory hold for Arlon PCB production?

Our facility operates under ISO 9001:2015 quality management and applies IPC-6012 Class 3 acceptance criteria for high-reliability aerospace, defense, and industrial builds. All Arlon builds can ship with material certificates of conformance, TDR impedance data, and AOI results. For defense programs, we offer IST results, microsection micrographs, and full serialized traceability.

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Arlon Material Quick Selector

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Global Engineering Reach

Arlon PCB Manufacturing for Engineers Worldwide

Aerospace avionics, defense EW, and industrial high-temperature electronics teams worldwide rely on APTPCB for custom PCB fabrication using Arlon polyimide and microwave laminates. Online quoting, DFM review, and worldwide shipping.

North America

USA · Canada · Mexico

Defense contractors, telecom OEMs, and hardware startups across the US and Canada rely on APTPCB for prototype and NPI builds. Same-day DFM review. ITAR-aware documentation is available on request.

AvionicsDefenseITAR-Aware

Europe

Germany · UK · Sweden · France

Automotive radar suppliers in Germany, defense electronics teams in the UK and France, and Scandinavian wireless R&D labs source prototypes and production-intent boards through our platform.

AerospaceEW SystemsHigh-Temp

Asia-Pacific

Japan · South Korea · Taiwan · India

5G base station manufacturers, satellite terminal developers, and hardware startups across APAC use our online quoting platform for prototypes and NPI runs with 24-hour DFM response.

IndustrialSatelliteNPI

Israel & Middle East

Israel · UAE · Saudi Arabia

Aerospace radar, defense EW, and SATCOM programs in the region rely on our extended qualification documentation packages and material traceability for defense procurement compliance.

DefenseRadarMIL-Spec

Start Your Arlon PCB Project

Share your Gerber files, material requirements, impedance targets, and performance specifications. Our engineering team will return a validated stack-up proposal, DFM review, and detailed quotation within one business day.