Taconic Advanced Dielectrics

Taconic RF & Microwave PCB Manufacturing

Precision fabrication of Taconic Advanced Dielectric Division laminates — from the workhorse RF-35 thermoset ceramic and TLY/TLX ultra-low-loss PTFE families to the high-Dk CER-10 ceramic-loaded substrate and the versatile fastRise® bond prepregs. Our factory processes every Taconic product line with validated plasma-etch workflows, hybrid stack-up engineering, and TDR/VNA impedance validation built for the most demanding military, aerospace, 5G telecommunications, and automotive radar programs. We stock RF-35 in 10-60 mil, TLY-5A in 5-31 mil, fastRise® bondply, and CER-10 in 20-40 mil for immediate production start.

Dk 2.17 - 10.0

Dielectric Range

Df < 0.0009

Ultra-Low Loss (TLY)

Full PTFE Line

Plasma Processing

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TLY / TLX / RF-35Full Series

Plasma DesmearPTFE Processing

+/-0.5 milTrace Tolerance

fastRise® / TacLamHybrid Bonding

TDR / VNAImpedance Verified

RF-35 StockedImmediate Start

ISO 9001Quality Certified

IPC-6012 CL3Acceptance

TLY / TLX / RF-35Full Series

Plasma DesmearPTFE Processing

+/-0.5 milTrace Tolerance

fastRise® / TacLamHybrid Bonding

TDR / VNAImpedance Verified

RF-35 StockedImmediate Start

ISO 9001Quality Certified

IPC-6012 CL3Acceptance

Global RF Manufacturing Partner

Taconic PCB Manufacturing for Global RF & Microwave Innovators

As a leading Taconic PCB manufacturer, APTPCB delivers advanced PTFE and ceramic-filled substrates to engineering teams across North America, Europe, and the Asia-Pacific. From Silicon Valley defense contractors developing Ka-band satellite transceivers to European automotive engineers designing 77 GHz ADAS radar systems, reliable microwave performance starts with precision fabrication. Taconic's Advanced Dielectric Division offers a comprehensive portfolio - from the ultra-low-loss TLY/TLX series to the ceramic-loaded RF-35 and high-Dk CER-10.

We process these advanced PTFE materials using dedicated plasma desmear chambers, specialized low-friction drill routing, and hybrid stack-up engineering (bonding Taconic RF layers to standard FR-4 using fastRise 27 prepreg). By maintaining a massive in-house inventory of RF-35, TLY-5A, and CER-10, we bypass long material lead times to deliver rapid prototyping and scalable mass production with TDR/VNA validated impedance.

Taconic TLY-5A PTFE laminate sheets in climate-controlled storage

Material Portfolio

Taconic Series & Models We Process

Our factory holds validated processing recipes for every product listed below. Each series has documented drill programs, etch parameters, lamination profiles, and quality acceptance criteria in our production database.

Series	Base Chemistry	Dk Range	Df (Typ. @ 10 GHz)	Key Characteristics	Primary Applications
TLY / TLY-5A	PTFE / woven E-glass	2.17 - 2.40	0.0009	Lowest-loss Taconic laminate. Woven fiberglass reinforcement provides mechanical stability while PTFE matrix delivers ultra-low dielectric loss. TLY-5A variant optimized for improved dimensional stability. Requires plasma desmear for reliable via metallization. Very low moisture absorption (0.02%).	Satellite LNA boards, Ka-band phased-array antenna feeds, military EW wideband receivers, stripline power combiners, VNA calibration substrates
TLX	PTFE / woven E-glass	2.45 - 2.65	0.0019	Moderate-loss PTFE with slightly higher Dk than TLY - enabling more compact microstrip trace geometries. Good balance of electrical performance and dimensional stability. Plasma desmear required.	Base-station duplexers and bandpass filters, Wilkinson power dividers, GPS/GNSS patch arrays, radar transmit/receive modules
TLC	PTFE / woven E-glass (economy grade)	2.95 - 3.20	0.0020	Cost-reduced PTFE entry point for applications needing better-than-FR-4 RF performance without justifying TLY premium. Plasma desmear required but processing is less demanding than pure-TLY.	Wi-Fi 6/7 front-end modules, Bluetooth antenna boards, ISM-band industrial monitoring radios, automotive V2X communication
RF-30 / RF-35	PTFE / woven E-glass / ceramic filler	3.00 - 3.50	0.0018	Ceramic-filled PTFE laminate (ORCER family). Dk 3.50 with tight +/-0.05 tolerance. Notably lower Df than Rogers RO4350B (0.0018 vs. 0.0037). Plasma desmear recommended for optimal via reliability. Lead-free solder compatible. RF-35A2 is the most commonly specified variant.	Sub-6 GHz 5G macro and small-cell antennas, power amplifier pallets, GPS receivers, WLAN enterprise access points, general commercial RF
CER-10 / CER-20 / CER-30	PTFE / ceramic filler (high-Dk)	10.0 - 30.0	0.0035	Extremely high dielectric constant enables physically small antennas and filters. Ceramic loading provides excellent Dk stability over temperature. Plasma desmear required. CER-10 (Dk 10) is the most commonly specified for extreme miniaturization.	Dielectric resonator antennas (DRA), compact cavity filters, horn antenna feed elements, miniaturized GPS L1/L2 patch antennas
fastRise 27 / 27HF	Low-loss thermoset bonding prepreg	2.72	0.0014	Specifically designed as bonding prepreg for hybrid multilayer builds combining PTFE signal cores with FR-4 structural cores. The low-loss resin system minimizes signal degradation at the bond interface. Compatible with both Taconic and Rogers RF cores.	Hybrid Taconic TLY/FR-4 multilayer boards, hybrid Rogers RO4350B/FR-4 bonding, high-speed digital boards with integrated RF sections
TacLam	Pure PTFE bonding film (unfilled)	2.10 - 2.35	0.0008	Ultra-low-loss PTFE bonding film for all-PTFE multilayer constructions. Dk and Df closely match TLY/TLX core materials. Requires careful lamination press-profile management (temperature and pressure precisely controlled).	All-PTFE multilayer stripline networks for satellite transponders, defense radar antenna panels requiring uniform PTFE dielectric
TF-260 / TF-290	PTFE / ceramic (thermally enhanced)	2.60 - 2.90	0.0015 - 0.0020	Thermally optimized PTFE laminates with improved thermal conductivity for power amplifier applications where substrate heat spreading matters. Plasma desmear required.	GaN and GaAs power amplifier boards for 5G base stations, high-power RF transmitter modules, tower-mounted amplifiers (TMA)

RF-35 cores (10-60 mil), TLY-5A (5-31 mil), fastRise 27, and CER-10 (20-40 mil) are stocked at APTPCB with 1/2 oz and 1 oz ED copper cladding. Other series and non-standard thicknesses are available from Taconic authorized distributors within 5-10 working days.

Engineering Reference

Detailed Electrical & Mechanical Properties

Comprehensive material data for the most frequently requested models. All dielectric values measured at 10 GHz using clamped stripline resonator method per IPC-TM-650 2.5.5.5 unless otherwise noted.

Property	TLY-5A	TLY-3	TLX-8	RF-35A2	CER-10	fastRise 27	Test Method
Dk @ 10 GHz	2.17 +/-0.02	2.33 +/-0.02	2.55 +/-0.04	3.50 +/-0.05	10.0 +/-0.25	2.72 +/-0.04	IPC-TM-650 2.5.5.5
Df @ 10 GHz	0.0009	0.0009	0.0019	0.0018	0.0035	0.0014	IPC-TM-650 2.5.5.5
Thermal Cond. (W/m·K)	0.23	0.26	0.26	0.62	0.42	0.28	ASTM E1461
CTE X/Y (ppm/°C)	25	18	15	14	8	12	IPC-TM-650 2.4.41
CTE Z (ppm/°C)	280	280	280	30	20	40	IPC-TM-650 2.4.41
Moisture Absorption (%)	0.02	0.02	0.02	0.06	0.05	0.03	IPC-TM-650 2.6.2.1
Peel Strength (lb/in)	6	8	8	8	5	6	IPC-TM-650 2.4.8
Tg (°C, DSC)	N/A (PTFE)	N/A (PTFE)	N/A (PTFE)	>280	N/A (PTFE)	>250	IPC-TM-650 2.4.25
Dielectric Strength (V/mil)	800	800	800	750	600	700	IPC-TM-650 2.5.6.2
Flammability (UL 94)	V-0	V-0	V-0	V-0	V-0	V-0	UL 94
Plasma Desmear Required	Yes	Yes	Yes	Yes (Recommended)	Yes	N/A (prepreg)	-

Data from Taconic Advanced Dielectric Division published datasheets. PTFE substrates have no meaningful glass transition temperature (Tg). Plasma desmear is the industry standard for ensuring via reliability in PTFE and ceramic-filled PTFE substrates.

RF-35 vs. RO4350B Comparison

Head-to-Head: Taconic RF-35 vs. Rogers RO4350B

RF-35 is positioned as a functional electrical alternative to RO4350B for commercial RF below 10 GHz. Note: RF-35 is PTFE-based while RO4350B is a hydrocarbon thermoset, meaning they have different processing requirements. This distinction matters when comparing against established Rogers RF laminate workflows.

Property	Taconic RF-35A2	Rogers RO4350B	Rogers RO4003C	Comparison & Impact
Dk @ 10 GHz	3.50 +/-0.05	3.48 +/-0.05	3.38 +/-0.05	Essentially identical between RF-35 and RO4350B.
Df @ 10 GHz	0.0018	0.0037	0.0027	RF-35 has 51% lower Df - significant insertion loss advantage.
Thermal Cond.	0.62 W/m·K	0.62 W/m·K	0.71 W/m·K	RF-35 and RO4350B matched; RO4003C 15% higher.
CTE Z-axis	30 ppm/°C	32 ppm/°C	46 ppm/°C	RF-35 slightly better than both Rogers options for PTH reliability.
Plasma Required	Yes (PTFE Plasma)	No (FR-4 Chem)	No (FR-4 Chem)	RO4350B uses standard FR-4 desmear; RF-35 requires dedicated PTFE plasma.
Cost Position	10-15% lower	Benchmark	Moderate premium	RF-35 is the most cost-effective of the three.

While RF-35 offers better electrical loss performance and cost savings, its PTFE matrix requires a capable board house with plasma desmear equipment. APTPCB operates dedicated plasma chambers to process RF-35 flawlessly.

Manufacturing Process

Specialized Fabrication Workflows for Taconic Substrates

Processing Taconic PTFE materials requires equipment, chemistry, and process knowledge that go beyond standard FR-4 manufacturing. Our factory addresses every critical fabrication step with purpose-built equipment and validated recipes developed through years of production experience with these specific substrate materials.

Every production lot follows documented procedures with real-time parameter monitoring. Process data including drill speeds, etch chemistry concentrations, plasma gas ratios, lamination temperatures, plating bath composition, and inspection results are archived per lot number for full traceability and continuous improvement analysis.

Our CAM engineering team reviews every incoming design for manufacturability before production begins, providing DFM feedback, impedance simulation data (Polar Si9000 with manufacturer Dk/Df curves), stack-up optimization recommendations, and material selection guidance at no additional charge.

Cross-section micrograph of a Taconic and FR-4 hybrid PCB stack

Reference Stack-Ups

Common Taconic Stack-Up Configurations

Representative configurations with validated press profiles and established supply chains. Custom configurations welcome — contact our engineering team with your specific requirements.

Configuration	Layers	Signal Cores	Structural	Bonding System	Applications
Pure TLY Stripline	2-4	TLY-5A all layers	-	TacLam PTFE bondply	Satellite LNA, calibration substrates, MIL-spec stripline networks
TLY Hybrid	4-8	TLY-5A (signal layers)	FR-4 or FR408HR	fastRise 27 prepreg	SATCOM transceivers, phased-array panels with digital control/power
Pure RF-35	2-6	RF-35A2 all layers	-	RF-35 bonding prepreg	5G antenna panels, GPS/GNSS arrays, Wi-Fi access point RF boards
RF-35 + FR-4 Hybrid	4-12	RF-35 (signal)	FR-4 (pwr/gnd)	FR-4 prepreg + fastRise 27	5G base stations with integrated digital, multi-band radio front ends
CER-10 Single-Layer	2	CER-10	-	-	DRA elements, compact filters, high-Dk patch antennas, matching networks
Mixed Taconic Multi-Band	4-8	TLY (RF) + RF-35 (IF)	FR-4	fastRise 27 + TacLam	Multi-band SATCOM transceivers, broadband EW receivers with IF processing
TLX Radar Front-End	2-4	TLX-8	-	TacLam	X-band and Ku-band radar T/R modules, weather radar feed networks
RF-35 + Metal Core	2-4	RF-35 (signal)	Aluminum backer	Thermal adhesive	High-power PA boards requiring heatsink integration, LED driver boards

Fabrication Capabilities

Taconic-Specific Manufacturing Controls

Six core capabilities that differentiate our Taconic production from general-purpose PCB manufacturing and keep specialized RF builds aligned with quick-turn execution windows.

PTFE Plasma Desmear & Surface Activation

Taconic TLY, TLX, CER, and RF-35 laminates are PTFE-based - chemically inert to standard alkaline permanganate desmear chemistry used in FR-4 processing. Our factory operates dedicated plasma treatment chambers using controlled O2/Ar gas mixtures at calibrated RF power levels to micro-roughen the PTFE hole wall surface before electroless copper seeding. The result is reliable barrel plating adhesion that consistently passes IST thermal cycling per IPC-TM-650 2.6.26.

Modified Drill Programs for PTFE Substrates

PTFE is a soft, thermoplastic material - drilling at standard FR-4 speeds generates frictional heat that smears molten fluoropolymer across the hole wall, insulating the inner-layer copper connection and causing open circuits or degraded via reliability. Our PTFE drill recipes use reduced spindle RPM (typically 40-60% of standard FR-4 settings), optimized chip-load feed rates, and specialty entry/backup materials selected to minimize burr formation and smear generation.

Controlled Impedance & Precision Etching

PTFE surfaces require modified etch chemistry parameters to achieve clean trace edges without sidewall undercutting or roughness that increases conductor loss at microwave frequencies through the skin-effect mechanism. Our wet-etch process holds trace line-width tolerance within +/-0.5 mil (12.7 um) on TLY and TLX substrates, preserving 50 ohm single-ended and 100 ohm differential impedance targets with better than +/-7% total tolerance.

Hybrid Stack-Up Engineering & Lamination

Different Taconic products require different lamination press profiles. Hybrid stacks combining Taconic PTFE signal layers with FR-4 structural cores require press profiles that satisfy both material systems simultaneously without over-curing the FR-4 or under-bonding the PTFE interface. Our CAM engineers model impedance at every dielectric boundary, select appropriate bonding materials (like fastRise 27), and balance CTE mismatch between PTFE and FR-4.

Humidity-Controlled Storage & Baking

All Taconic PTFE laminates undergo documented pre-lamination bake cycles per Taconic's material handling guidelines before entering the lamination press. Typical bake parameters are 2-4 hours at 105-120 °C in calibrated forced-air convection ovens. Even small amounts of absorbed moisture measurably increase Dk and Df, shifting impedance. Incoming material is stored in our climate-controlled warehouse maintained below 45% relative humidity.

RF Surface Finish Selection & PIM Control

Our recommendations: immersion silver (5-15 uin Ag) for the lowest surface resistivity on RF signal traces - minimal skin-depth loss impact above 1 GHz. ENIG (120-240 uin Ni / 2-4 uin Au) for assemblies requiring multi-reflow compatibility with fine-pitch BGA/QFN components. ENEPIG (with palladium barrier) for antenna boards subject to PIM qualification. HASL is generally not recommended for RF applications.

Quality & Validation

Documented Quality at Every Manufacturing Step

Our quality management system operates under ISO 9001:2015 certification with IPC-6012 acceptance criteria (Class 2 standard, Class 3 for high-reliability) applied to every production lot. In-process inspection includes automated optical inspection (AOI) at inner layer, outer layer, and solder mask stages; electrical continuity and isolation testing via flying probe or fixture; and dimensional verification against customer specifications, following the same disciplined PCB quality workflow used across our production programs.

For controlled-impedance builds, TDR-measured impedance coupons are included on every production panel with measurement data recorded against simulation targets. Extended validation options include VNA S-parameter sweeps on dedicated test vehicles (insertion loss, return loss, phase from DC through 40 GHz), cross-section micrograph analysis with dimensional annotations, IST reliability testing per IPC-TM-650 2.6.26, and full IPC-6012 Class 3 documentation packages.

For automotive programs, we follow IATF 16949 quality practices. For aerospace and defense programs, extended documentation packages including environmental test reports (thermal shock, moisture resistance, vibration), microsection micrographs, and serialized traceability from raw material lot through final shipping inspection are available.

VNA S-parameter measurement workstation for Taconic validation

Industry Applications

Where Taconic PCBs Serve

Taconic substrates serve the most demanding applications across telecommunications, automotive, aerospace, defense, data center, medical, and industrial markets, especially in advanced antenna PCB programs.

Telecommunications

5G & Wireless Infrastructure

Massive MIMO antenna panels and beamforming feed networks for sub-6 GHz (3.5/4.9 GHz) and mmWave (28/39 GHz) 5G base stations. RF-35 offers RO4350B-equivalent performance with competitive pricing and shorter lead times for high-volume production runs.

Satellite & Space

SATCOM & LEO Terminals

VSAT terminal RF front ends, LEO phased-array user terminals (Starlink, OneWeb), and GEO transponder power amplifier boards. TLY-5A's ultra-low loss (Df 0.0009 at 10 GHz) preserves receive-chain link budget where every 0.1 dB matters.

Defense

Military Radar & Electronic Warfare

AESA radar transmit/receive modules, electronic warfare wideband receiver front ends and jamming arrays. TLX and TLY substrates have MIL-qualified heritage on operational platforms demanding 20+ year field reliability under extreme thermal cycling.

Automotive

24 GHz & 77 GHz ADAS Radar

Short-range and long-range automotive radar sensor front ends. CER-10's high dielectric constant (Dk 10.0) enables physically compact 77 GHz antenna patch elements that fit within severely constrained sensor housing geometries.

Test & Measurement

Calibration & Reference Standards

VNA calibration substrates, reference transmission line standards, and probe-station interposers. TLY-5A's tightly controlled dielectric properties (Dk variation less than +/-0.5%) make it the preferred substrate for metrology-grade measurement fixtures.

Industrial & IoT

Wireless Connectivity & ISM-Band

Wi-Fi 6/7 front-end modules, LoRaWAN concentrator boards, and ISM-band (915 MHz, 2.4 GHz, 5.8 GHz) industrial monitoring radios. TLC and RF-35 provide adequate RF performance at cost points suitable for high-volume commercial IoT.

Material Selection Guide

How to Choose the Right Taconic Material for Your Design

The optimal Taconic laminate depends on three primary factors: operating frequency, acceptable insertion loss, and cost sensitivity. Here is a practical selection framework based on our manufacturing experience across thousands of Taconic builds.

Below 6 GHz, Cost-Sensitive Projects - RF-35

For commercial RF applications operating below 6 GHz - including sub-6 GHz 5G NR (n77/n78/n79 bands), Wi-Fi 6E, GPS/GNSS L1/L2/L5, Bluetooth 5.x, and general ISM-band designs - RF-35 is the natural first choice. It provides RO4350B-class dielectric performance (Dk 3.50, Df 0.0018 at 10 GHz). While it requires plasma desmear for via reliability, its overall cost (material + processing) remains highly competitive for volume production. The material is stocked at APTPCB for immediate production start.

6-20 GHz with Moderate Loss Budget - TLX

When operating frequency moves into the 6-20 GHz range - covering C-band (4-8 GHz), X-band (8-12 GHz), and lower Ku-band (12-18 GHz) applications such as military surveillance radar, weather radar, satellite IF processing, and point-to-point backhaul radios - TLX (Dk 2.45-2.65, Df 0.0019 at 10 GHz) provides a good balance of loss performance and cost. TLX is a PTFE substrate requiring plasma desmear, but its higher Dk compared to TLY enables more compact microstrip trace widths, reducing board footprint.

Above 20 GHz or Where Ultra-Low Loss Is Required - TLY-5A

For applications operating above 20 GHz - including Ka-band SATCOM (26.5-40 GHz), E-band point-to-point links (71-86 GHz), military Ka/Q-band radar, and any design where insertion loss is the binding performance constraint - TLY-5A (Dk 2.17, Df 0.0009 at 10 GHz) delivers Taconic's absolute lowest dielectric loss. This is Taconic's direct equivalent to Rogers RT/duroid 5880, and our factory processes both materials with identical plasma desmear, drill, and lamination workflows.

Miniaturized Antennas & High-Dk Applications - CER-10

When physical antenna or filter dimensions must be minimized - for example, in automotive 77 GHz radar sensor housings or handheld device embedded antennas - CER-10 (Dk 10.0) enables antenna elements approximately 1/sqrt(10) ~ 0.32x the linear dimension of an equivalent design on a standard Dk 3.5 substrate. The trade-off is higher dielectric loss (Df 0.0035 at 10 GHz) compared to pure PTFE, plus the additional processing complexity of plasma desmear.

FAQ

Taconic PCB Manufacturing FAQ

How does Taconic TLY-5A compare to Rogers RT/duroid 5880 in practice?

Both are woven-glass PTFE laminates with very similar published specifications - Dk approximately 2.17-2.20 and Df below 0.001 at 10 GHz. In our production experience across hundreds of builds, they deliver equivalent RF performance when processed with the same plasma desmear and controlled-impedance workflows. Our factory uses identical processing recipes for TLY-5A and RT/duroid 5880. The practical choice typically comes down to material availability and unit pricing for your required quantity.

Is RF-35 a true drop-in replacement for Rogers RO4350B?

Electrically, yes. Manufacturing-wise, no. RF-35A2 matches RO4350B's nominal dielectric constant (3.50) and offers a significantly lower dissipation factor (0.0018 vs. 0.0037 at 10 GHz). However, because RF-35 is a PTFE-based ORCER material, it requires plasma desmear for reliable via metallization, whereas RO4350B is a hydrocarbon resin that processes with standard FR-4 permanganate chemistry. Our factory easily handles both, but you cannot simply swap them at a standard FR-4 board house without PTFE plasma capabilities.

Which Taconic materials do you stock for immediate production start?

We stock the following Taconic products in our climate-controlled facility: RF-35 and RF-35A2 cores in 10, 20, 30, and 60 mil thicknesses; TLY-5A cores in 5, 10, 15, 20, and 31 mil thicknesses; fastRise 27 bonding prepreg in 2, 3, and 4 mil thicknesses; and CER-10 cores in 20, 25, and 40 mil thicknesses. Non-stocked items can be expedited from Taconic's authorized distribution network within five to ten working days depending on geographic region and current availability, while stocked builds can move directly into pilot-production workflows.

Can Taconic PTFE substrates be hybridized with FR-4 or metal-backed constructions?

Yes - hybrid construction is among our most frequently built Taconic configurations. TLY or TLX PTFE signal layers bond to FR-4 structural cores using Taconic fastRise 27 bonding prepreg, which provides a low-loss (Df 0.0014) bond interface. Our CAM engineers balance CTE mismatch between PTFE (Z-axis CTE ~280 ppm/°C) and FR-4 (~45 ppm/°C) by designing symmetrical stack-ups. For thermal management, we also build RF-35 or TLY signal layers bonded to aluminum backing plates.

What surface finishes do you recommend for Taconic PTFE RF boards?

Immersion silver (5-15 uin Ag) is our default for high-frequency RF signal traces - it provides the lowest surface resistivity, minimizing skin-effect conductor loss above 1 GHz. ENIG (120-240 uin Ni / 2-4 uin Au) is recommended when the assembly includes fine-pitch components requiring multi-reflow capability. ENEPIG is specified for antenna boards that must pass PIM qualification. HASL is generally not recommended for RF applications on any Taconic substrate due to surface roughness.

What are typical lead times for Taconic PCB prototypes?

For builds using stocked materials (RF-35, TLY-5A, CER-10 in standard thicknesses), prototype lead times are: simple two-layer boards: 3-5 working days; multilayer (4-8 layers): 7-10 working days; complex hybrid Taconic/FR-4 constructions: 10-14 working days. If the specified Taconic model or thickness is not in our inventory, add the material procurement lead time (5-10 working days). For urgent programs, we offer expedited processing with priority production scheduling.

Interactive Tool

Taconic Material Quick Selector

Browse all Taconic laminate models with specifications. Data from Taconic published datasheets.

Choose a Taconic Model

Model

Select a model to view specs.

Global Engineering Reach

Taconic PCB Manufacturing for Engineers Worldwide

From RF-35 5G antenna panels to TLY-5A military EW boards, APTPCB ships Taconic PCBs to engineering teams on four continents. Online quoting and 24-hour DFM review simplify international procurement.

North America

USA · Canada · Mexico

Defense contractors, telecom OEMs, and hardware startups across the US and Canada rely on APTPCB for prototype and NPI builds. Same-day DFM review. ITAR-aware documentation is available on request.

Defense5GITAR-Aware

Europe

Germany · UK · Sweden · France

Automotive radar suppliers in Germany, defense electronics teams in the UK and France, and Scandinavian wireless R&D labs source prototypes and production-intent boards through our platform.

ADAS RadarEW SystemsTelecom

Asia-Pacific

Japan · South Korea · Taiwan · India

5G base station manufacturers, satellite terminal developers, and hardware startups across APAC use our online quoting platform for prototypes and NPI runs with 24-hour DFM response.

5G InfraSatelliteNPI

Israel & Middle East

Israel · UAE · Saudi Arabia

Aerospace radar, defense EW, and SATCOM programs in the region rely on our extended qualification documentation packages and material traceability for defense procurement compliance.

AerospaceDefense RadarSATCOM

Start Your Taconic PCB Project

Share your Gerber files, material requirements, impedance targets, and performance specifications. Our engineering team will return a validated stack-up proposal, DFM review, and detailed quotation within one business day.