Materials

Taconic RF & Microwave PCB Manufacturing

We manufacture Taconic-based RF, mmWave, and aerospace boards using stocked RF-30/35, TLY/TLY-5A, CER-10, and fastRise® bondply kits. Drawing from Taconic’s datasheets and our RayPCB mirror logs, we maintain plasma, lamination, and RF validation flows that keep loss tangents at 0.0009–0.003 and phase error in check up to 39 GHz.

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Sub-6G / Ka / 39 GHzBands
Df 0.0009–0.0035Loss
Taconic + FR-4Hybrid
Cores & bondplyFormats
Plasma + VNAValidation

Why Teams Select Taconic Laminates

Ultra-Low Loss PTFE

TLY/TLY-5A cores deliver Dk 2.17–2.65 and Df 0.0009 at 10 GHz, matching mmWave antenna and phased-array needs.

  • Stable epsilon across -55 to 150 °C
  • Stocked 5–30 mil cores
  • Reverse-treated copper for low conductor loss

Hybrid Cost Strategy

fastRise® bondply joins Taconic RF layers to FR-4 control planes, keeping material BOMs 30–40% below full PTFE builds.

  • Documented press/bond curves
  • Plane split and keep-out diagrams
  • CTE alignment with spread-glass FR-4

High-Dk Miniaturization

CER-10/CER-20 ceramics reach Dk 10–20 for filters, horn feeds, and compact resonators where footprint is critical.

  • ±0.25 mil thickness tolerance
  • Laser-machined cavities and coins
  • Bondable to aluminum backers

Taconic Series Supported in Production

Summary of the Taconic families we keep on our line sheets. Values mirror Taconic datasheets and RayPCB deployments.

SeriesTypical UseModels Stocked
RF-30 / RF-35 (Glass/PTFE)Remote radio, PA, 5G sub-6 GHzRF-30A1, RF-35A2, RF-35LOS
TLY / TLY-5A (Woven PTFE)mmWave antenna, phased arrayTLY-5A, TLY-3, TLY-2.2
fastRise® BondplyHybrid bond, sequential lamfastRise 27/27HF, 62N
CER-10 / CER-20 (Ceramic/PTFE)High-Dk filters, horn feedsCER-10, CER-20, CER-30
Thermal LaminatesRF power & base stationsTF-260, TF-290, TLA series

Key Taconic Material Properties

MaterialDielectric Constant @10 GHzDissipation FactorThermal Conductivity (W/m·K)
TLY-5A (0.010 in)2.17 ±0.020.00090.23
RF-35A2 (0.020 in)3.50 ±0.050.00140.25
RF-60A (0.030 in)6.15 ±0.150.00250.35
CER-10 (0.025 in)10.2 ±0.250.00350.40
fastRise® 27 Bondply2.90.00210.24

Values extracted from Taconic application notes and RayPCB reference builds; confirm exact Dk/Df versus the lot certificate used for your stack.

Reference Stackups We Ship Frequently

6-Layer Hybrid (TLY-5A + FR-4)

TLY-5A RF outers with fastRise® bondply tying into FR-4 digital cores.

  • Microstrip 50 Ω + coplanar 70 Ω
  • FR-4 control layers for MCU/FPGA
  • fastRise® press log included

4-Layer RF-35 Base Station

Pure RF-35 structure for filters and PA feed networks.

  • Laser-trimmed cavities
  • ENIG selective finish
  • VNA coupon data zipped

8-Layer CER-10 / FR-4 Mix

High-Dk CER-10 cores on inner layers with FR-4 structure and copper coins for stiffness.

  • Embedded coins under amplifiers
  • Backdrill + mask keep-outs documented
  • Thermal strap drawings attached

Taconic-Focused Fabrication Controls

PTFE Plasma Treatment

TLY/TLY-5A receive vacuum plasma to activate hole walls before metallization.

  • Recipe logged per lot
  • Hole wall energy test coupons
  • Pre-bake 125 °C / 2 h

fastRise® Lamination Windows

Press temperature/pressure ramps recorded to limit bondline voids.

  • Ramp ≤3 °C/min
  • Pressure 275–350 psi
  • Cool under pressure to 80 °C

Copper Roughness Control

Reverse-treated and rolled foils measured for Ra/Rz before imaging for predictable loss.

  • Ra reported on traveler
  • Micro-etch depth ±0.2 µm
  • Huray parameters archived

RF Validation

Every RF lot ships with TDR, optional VNA 39 GHz, and coupon microsection results.

  • ±5% impedance acceptance
  • Phase-matching logs for arrays
  • Data zipped with C of C

Taconic Application Snapshots

5G Remote Radios

RF-30/35 hybrids for 3.5 GHz radio heads with FR-4 logic planes.

  • Selective ENIG on RF pads
  • Lens/cavity machining ±50 µm
  • Field-service coupons

Automotive Radar (77 GHz)

TLY-5A microstrip antennas with aluminum backers and molded radomes.

  • Phase match ±1° per channel
  • VLP copper with mask relief
  • Environmental logs −40↔125 °C

Aerospace Filters & Horns

CER-10 cavities bonded to aluminum for satellite payloads.

  • High-Dk shrink factor recorded
  • Coined heat spreaders
  • Outgassing data available

Taconic Stack Selection Prompts

Checklist we run before freezing a Taconic-based stackup.

RF corridors

Capture frequency, launch style, and allowable loss to map RF-30 vs TLY vs CER.

  • Connector/launch type
  • Target line impedance

Hybrid planning

Define which layers stay Taconic and where FR-4 or metals provide structure.

  • Bondply choice
  • CTE balance notes

Validation

Plan VNA/TDR coupon strategy and ESS screening before production release.

  • Coupon coordinates
  • Thermal/ESS prompts

Taconic PCB FAQ

Do you stock specific Taconic thicknesses?

Yes. RF-30/35 (10–60 mil), TLY-5A (5–30 mil), fastRise® bondply, and CER-10 (20–40 mil) are on hand. Uncommon lots can be expedited via Taconic distributors.

How do you handle PTFE desmear?

Taconic PTFE is plasma-treated with oxygen/argon mixes; mechanical drills are slowed to reduce smear and plasma recipes are logged per lot.

Can Taconic be hybridized with FR-4 or metal cores?

Yes. We pair Taconic RF layers with spread-glass FR-4 or aluminum backers using fastRise® or low-flow adhesives while tracking press curves and coin interfaces.