Ceramic PCB Capability
Ceramic PCB Manufacturing Capabilities
APTPCB specializes in high-performance Ceramic PCB solutions using advanced manufacturing processes such as DPC, LTCC, and DBC. Our ceramic PCBs offer superior thermal management, high reliability, and excellent electrical performance for demanding applications in power electronics, automotive, medical devices, aerospace & defense, and high-frequency RF systems.
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Ceramic PCB Manufacturing Capabilities – APTPCB
APTPCB specializes in high-performance Ceramic PCB solutions, leveraging advanced manufacturing processes such as DPC, LTCC, and DBC. Our ceramic PCBs offer superior thermal management, high reliability, and excellent electrical performance, making them ideal for demanding applications in:
- Power Electronics: LED lighting, IGBT modules, power converters
- Automotive: Engine control units, power modules
- Medical Devices: High-precision sensors, implantable devices
- Aerospace & Defense: High-temperature modules, RF/microwave components
- High-Frequency & RF: Antennas, filters, amplifiers
We work with a range of advanced ceramic materials to meet specific thermal conductivity and electrical performance requirements, ensuring optimal solutions for your most critical designs.
Ceramic PCB Manufacturing Capabilities – APTPCB
| Item | Capability Category | Detailed Specification | Notes / Remarks |
|---|---|---|---|
| 1 | Base Ceramic Materials | 96% Alumina (Al2O3) ceramics substrate Aluminum Nitride (AlN) ceramics substrate | Excellent thermal and electrical properties. |
| 2 | Thermal Conductivity | 96% Alumina (Al2O3): 20 - 27 W/m·K Aluminum Nitride (AlN): 180 - 220 W/m·K | Critical for high-power and high-heat dissipation applications. |
| 3 | Ceramic Substrate Size (Max) | Standard: 114x114mm, 120x120mm, 140x130mm, 190x140mm | Custom sizes available upon request. |
| 4 | Material Thickness | 0.2mm, 0.25mm, 0.3mm, 0.38mm, 0.5mm, 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm | Range to meet diverse application needs. |
| 5 | Production Technologies | DPC (Direct Plated Copper): 0.5 - 10 oz LTCC (Low-Temperature Co-fired Ceramic) DBC (Direct Bonded Copper) | Offering comprehensive ceramic manufacturing solutions. |
| 6 | Layers | 1 Layer, 2 Layers | Single and double-sided ceramic PCBs. |
| 7 | Copper Weight (Finished) | H/H, 1/1, 2/2, 3/3, 4/4, 5/5, 6/6, 7/7, 8/8, 9/9, 10/10 oz | Achievable with DPC/DBC processes. |
| 8 | Min. Line Width / Spacing (DPC) | For 5-10 µm Cu: 0.05 mm / 0.05 mm (2 / 2 mil) For 18 µm (0.5 oz) Cu: 0.075 mm / 0.075 mm (3 / 3 mil) For 35 µm (1 oz) Cu: 0.1 mm / 0.1 mm (4 / 4 mil) For 70 µm (2 oz) Cu: 0.127 mm / 0.127 mm (5 / 5 mil) For 105 µm (3 oz) Cu: 0.3 mm / 0.3 mm (12 / 12 mil) For 210 µm (6 oz) Cu: 0.5 mm / 0.5 mm (20 / 20 mil) For 300 µm (9 oz) Cu: 0.6 mm / 0.6 mm (24 / 24 mil) | Fine line technology for high-density designs. |
| 9 | Min. Drilling Holes | 0.06 mm (2.4 mil) | High-precision mechanical drilling. |
| 10 | Hole Diameter Tolerance | ±20% (for drilling holes) | |
| 11 | Drilling Shift Angle | ±0.025 mm | Precision in hole alignment. |
| 12 | Slot Holes Tolerance | L ≥ 2XW: long ±0.05mm, wide ±0.025mm L < 2XW: long ±0.025mm, wide ±0.010mm | Precision for various slot hole dimensions. |
| 13 | Laser Drilling Capabilities | 0.1 mm (for 0.25 / 0.38 / 0.5 mm board thickness) 0.15 – 0.2 mm (for 0.635 mm board thickness) 0.2 – 0.35 mm (for 1.0 mm board thickness) 0.4 – 0.5 mm (for 1.5 mm board thickness) 0.5 – 0.6 mm (for 2.0 mm board thickness) | Laser drilling for specific hole requirements based on board thickness. |
| 14 | Min. Hole-to-Hole Spacing | 0.15 mm (center to center) | For densely packed vias/holes. |
| 15 | Copper Plating Filled Via (DPC) | Aspect Ratio ≤ 5:1, Board Thickness ≤ 0.635 mm | For enhanced thermal and electrical performance. |
| 16 | Outer Shape to Copper Distance | 0.15 – 0.2 mm | Critical for outline precision. |
| 17 | Outer Dimensions Tolerance | ≤ ±0.05 mm | High precision for overall board dimensions. |
| 18 | Laser Outline / Cutting | Cutting Line to Line 0.5 mm Residual thickness tolerance: ±0.05 mm Position tolerance: ±0.025 mm Cutting line to cutting line tolerance: ±0.025 mm Laser outline tolerance: ±0.1 mm | Max Laser cutting board thickness ≤3.0mm. Laser scribing depth ≤0.7mm. |
| 19 | Solder Mask Thickness | 10 - 30 µm (line surface) | For precise solder mask application. |
| 20 | Solder Mask Tolerance | ±0.05 mm | For accurate solder mask openings. |
| 21 | Min. Solder Mask Opening (Pad) | 0.15 mm | For fine pitch pads. |
| 22 | Min. Solder Mask Line Width | For 1 oz Cu: 0.05 mm For 2 oz Cu: 0.075 mm For 3 oz Cu: 0.1 mm For 4 oz Cu: 0.125 mm | Specific to copper weight for optimal adhesion and definition. |
| 23 | Silkscreen (Legend) Min. Width | 0.15 mm | For clear and precise component marking. |
| 24 | Silkscreen to Pad Distance | 0.15 mm | Avoiding encroachment on pads. |
| 25 | Min. Silkscreen Diameter | 0.75 mm | For small fiducials or alignment marks. |
| 26 | Min. Silkscreen Gap | 0.15 mm | For definition between silkscreen elements. |
| 27 | Surface Finishes | OSP: 0.2 – 0.5 µm Immersion Silver: ≥0.5 µm Immersion Tin: 0.8 – 1.2 µm Immersion Gold (ENIG): Ni 3-8 µm, Au 0.03-0.3 µm Electroless Nickel Palladium Immersion Gold (ENEPIG): Ni 3-8 µm, Pd 0.05-0.1 µm, Au 0.05-0.1 µm | Comprehensive range of finishes for diverse bonding and assembly methods. |
| 28 | Copper Foil Peel Strength | >2 N/mm (per IPC-TM-650 2.4.8) | Ensuring robust adhesion of copper to ceramic. |
| 29 | Thermal Resistance | 350 ± 10℃, 15 min without delamination or blistering (per IPC-TM-650 2.4.7) | High-temperature reliability for demanding applications. |
| 30 | Solderability | >95% wetting (per IPC-TM-650 2.4.14) | Ensuring reliable solder joint formation. |
| 31 | Bow & Twist | ≤ 0.3 mm (3‰ per 100 mm) | For optimal flatness. |
| 32 | Quality Standards | IPC-A-600 Class 2 / Class 3 | All PCBs manufactured to rigorous industry standards. |
| 33 | Certifications | ISO 9001:2015, UL Certified | RoHS & REACH compliant; IATF 16949 (for automotive) on request. |
| 34 | Electrical Test | 100% E-test (Flying Probe or Fixture Test) | Comprehensive testing for opens/shorts and continuity. |
The APTPCB Advantage in Ceramic PCB Manufacturing
Ceramic PCBs are chosen for their exceptional thermal conductivity, robust mechanical properties, and ability to withstand high temperatures and harsh environments. Our advanced manufacturing capabilities allow us to produce highly reliable and precise ceramic circuits:
- Diverse Material Options: Utilizing 96% Alumina (Al2O3) and Aluminum Nitride (AlN) for tailored thermal performance.
- Advanced Production Technologies: Expertise in DPC (Direct Plated Copper), LTCC (Low-Temperature Co-fired Ceramic), and DBC (Direct Bonded Copper) processes.
- Fine Line & Space Technology: Achieving ultra-fine circuit patterns for high-density integration.
- Precision Drilling & Laser Processing: Capable of micro-drilling and high-accuracy laser outlining.
- Excellent Thermal & Mechanical Reliability: Meeting stringent standards for thermal cycling, adhesion, and solderability.
Our engineering team provides comprehensive DFM (Design for Manufacturability) support, helping you optimize your ceramic PCB designs for performance, reliability, and cost-effectiveness.
Your Partner for High-Performance Ceramic PCB Solutions
The unique advantages of ceramic PCBs require specialized expertise in design and manufacturing. APTPCB's engineering team is ready to support your most challenging projects. We offer:
- Material Selection Expertise: Guiding you in choosing the optimal ceramic substrate (Al2O3 or AlN) for your thermal and electrical requirements.
- DFM Support for Ceramic Processes: Optimizing your layout for DPC, LTCC, or DBC processes, considering unique aspects like copper adhesion, plating filled vias, and laser processing.
- Thermal Management Analysis: Assisting in designing for efficient heat dissipation.
- Custom Stack-up & Via Design: Tailoring solutions for complex ceramic interconnects.
By partnering with APTPCB, you gain access to advanced ceramic PCB manufacturing capabilities and dedicated engineering support, ensuring your high-power, high-frequency, or high-reliability applications achieve optimal performance and long-term stability.
Frequently Asked Questions
What ceramic materials do you support?
96% Alumina (Al₂O₃) with 20–27 W/m·K and Aluminum Nitride (AlN) with 180–220 W/m·K; AlN for extreme heat dissipation, Alumina for cost-effective builds.
Which ceramic PCB processes are available?
DPC (Direct Plated Copper), LTCC (Low-Temperature Co-fired Ceramic), and DBC (Direct Bonded Copper), selected based on cost, density, and thermal targets.
What are key specification limits?
Max substrate about 190×140 mm, thickness 0.2–1.5 mm, min line/space down to 0.05 mm (DPC), drills to 0.06 mm, copper weight up to 10 oz depending on process.
Can ceramic PCBs handle high-frequency applications?
Yes. Low dielectric loss and stable dielectric constant make ceramics suitable for RF/microwave antennas, filters, and amplifiers.
What is typical lead time?
About 10–25 working days depending on material, complexity, and volume; early engagement helps optimize schedule.
Partner with APTPCB for High-Performance Ceramic PCB Solutions
The unique advantages of ceramic PCBs require specialized expertise in design and manufacturing. Our engineering team is ready to support your most challenging projects with advanced ceramic PCB capabilities and dedicated engineering support.