ALUMINUM / COPPER MCPCB
Fabricate aluminum MCPCB with 1–8 W/m·K dielectrics, vacuum lamination, and copper-filled thermal vias so lighting, EV, and industrial systems stay cool and reliable.
APTPCB provides metal core PCB (MCPCB) manufacturing using aluminum and copper substrates to deliver efficient heat dissipation for LED and power applications. We focus on stable layer construction and thermal pathway consistency so assemblies can maintain heat transfer performance over time and across production batches.
For MCPCB assembly, we optimize processes around thermal pads, power device placement, and functional verification to ensure both electrical reliability and effective heat conduction. By combining thermal-focused fabrication with assembly discipline, APTPCB helps customers achieve longer operating life, improved stability, and better performance in compact, heat-sensitive designs.
Lighting, EV, industrial, and telecom power builds that rely on our aluminum MCPCB platforms.
Vacuum lamination, IR thermography, ASTM D5470 conduction tests, and Hi-Pot up to 4 kV verify every MCPCB lot.
Single- and multi-layer MCPCB platforms, copper coin integration, and turnkey assembly for thermal performance.
Single-layer aluminum, double-layer MCPCB, copper base, hybrid MCPCB + FR-4, and rigid-flex thermal harnesses.
Match dielectric conductivity, thickness, and isolation to heat flux and voltage requirements.
Every MCPCB undergoes lamination checks, flatness measurement, IR thermography, and Hi-Pot testing to 4 kV to ensure safe operation.
Thermal Stackup Review
Map heat flux and isolation requirements to dielectrics and base metal.
Tooling & Imaging
LDI imaging with compensation for thick copper and slots.
Lamination & Bonding
Vacuum lamination bonds dielectric to aluminum/copper base.
Drill & Thermal Vias
Drill, plate, and fill vias or machine coin pockets.
Surface Finish & Assembly Prep
Apply soldermask, finish, and prepare carriers for heavy panels.
Validation & Test
IR thermography, D5470, Hi-Pot, and electrical testing.
Metal Base Stack-Up
Anodize and prepare the aluminum base, then laminate the thermal dielectric and copper while monitoring interface roughness and adhesion.
Machining & Final Finish
Drill/tap, CNC the outline, finish with ENIG/OSP, and run LED/automotive-grade thermal cycling plus hi-pot tests.
Define dielectric selection, copper thickness, and machining features before fab.
Process engineers monitor lamination, fill, and thermal tests, closing the loop with design.
Efficient thermal paths, simplified assembly, and better reliability.
Dielectrics up to 8 W/m·K plus copper vias evacuate heat quickly.
Hi-Pot tested insulation keeps LEDs and power modules safe.
Support aluminum, copper, hybrid, and rigid-flex thermal designs.
Vacuum lamination holds TIM interfaces flat and smooth.
Replace secondary heatsinks and hardware with integrated MCPCB.
Thermal + electrical reports accelerate customer approval.
ASTM D5470 conduction data, IR imagery, and Hi-Pot logs confirm every MCPCB shipment.
Carrier fixtures, torque specs, and coating plans let LED and power modules drop directly into SMT.
Integrating heat spreading into the PCB shortens thermal paths and reduces mechanical complexity.
Ideal for LED, automotive, industrial, and telecom designs that demand strong thermal paths.
Shorter heat paths improve lifetime, brightness, and reliability.
High-brightness, grow, and architectural lighting.
Headlamps, exterior lighting, and charger modules.
Motor drives, robotics, and power distribution.
Power amplifiers and RF combiners needing thermal control.
Beacon, radar, and mission lighting modules.
Imaging, therapy, and surgical lighting with strict thermal limits.
Wearables and compact modules using MCPCB tails.
Load banks and IR calibration equipment.
Balancing conduction, isolation, and manufacturability requires careful planning.
Thinner dielectrics improve conduction but reduce breakdown voltage.
Poor lamination leaves air gaps and reduces cooling efficiency.
LED packages and aluminum bases expand differently, stressing solder joints.
Finish choice alters reflectivity, solderability, and bond wire compatibility.
Metal-backed boards store heat and require special fixtures.
Without documented IR/D5470 results, approvals can stall.
Thermal/Isolation Modeling
We recommend dielectric thickness to meet both W/cm² and Hi-Pot targets.
Vacuum Lamination Control
Process controls deliver flat, void-free TIM surfaces.
CTE Balancing
Select base alloys and bonding films that match component expansion.
Finish Best Practices
Guidance on OSP, silver, ENIG, or ENEPIG usage.
Thermal Test Packages
IR, D5470, and Hi-Pot data bundled with each shipment.
Innovation Roadmap
Emerging technologies shaping the future of manufacturing, signal integrity, and system integration.
01
Automated selective copper thickening for high-current paths without manual assembly steps.
02
Integrated microfluidic channels in metal-core substrates for direct liquid cooling.
03
MCPCB platforms for UV curing, IR heating, and specialized spectral applications.
04
Embedded sensors and drivers for real-time monitoring, paired with FEA-validated thermal models.
Thermal performance rises with dielectric conductivity and machining—reserve premium materials and coins for true hotspots. Reusing panel sizes, drill programs, and finishes keeps quoting and production fast. Share heat flux, isolation, and finish preferences early so we can map the lightest viable stackup.
Use 4–8 W/m·K dielectrics only under high-power components.
Select OSP or silver for LEDs; ENIG/ENEPIG only where necessary.
Combine MCPCB under hotspots with FR-4 elsewhere.
Panelize multiple lamp engines to maximize material usage.
Full D5470/IR for qualification, sampling for production.
Early reviews prevent over-spec’d copper or finish requirements.
Reuse insert and screw patterns to limit machining.
Reserve high-conductivity dielectrics in advance to avoid expedite fees.
Quality, environmental, and industry credentials supporting reliable manufacturing.
Quality management for IMS fabrication.
Environmental controls for aluminum processing.
Medical lighting and imaging traceability.
Automotive thermal systems documentation.
Aerospace-grade process governance.
Class 3 acceptance for rigid and flex-rigid MCPCBs.
Safety and flammability compliance.
Material compliance for global shipments.
Quality & Cost Console
Unified dashboard connecting quality checkpoints with the economic levers that compress cost.
Process & Reliability
Stack-Up Validation
Pre-Lamination Strategy
• Rotate outlines, mirror flex tails
• Share coupons across programs
• Reclaim 5-8% panel area
Registration
Registration
Laser Metrology
• Online laser capture
• ±0.05 mm tolerance band
• Auto-logged to SPC
Testing
Testing
Electrical Test
• TDR coupons per panel
• IPC-6013 Class 3
• Force-resistance drift logged
Integration
Integration
Assembly Controls
• Nitrogen reflow
• Inline plasma clean
• 48h logistics consolidation
Architecture
Architecture
Cost Strategy
• Balance cost vs performance
• Standardize on common cores
• Low-loss only on RF layers
Microvia Planning
Microvia Planning
Via Cost Savings
• Avoid stacked microvias
• Share backdrill tools
• Minimize fill costs
Utilization
Utilization
Panel Optimization
• Rotate for nesting efficiency
• Share test coupons
• Standardize tooling
Execution
Execution
Supply Chain Levers
• Pool low-loss material
• Dual-source laminates
• Match finish to need
Material, thermal, and assembly answers for MCPCB designers.
Send stackups, heat maps, and assembly requirements—our engineers respond with DFx notes, validation scope, and lead time within one business day.
