Assembly Services

Turnkey PCB Assembly Built for Real-World Schedules

APTPCB is an electronics manufacturer offering end-to-end PCB assembly (PCBA) services—from component sourcing and kitting to SMT & through-hole assembly, inspection, testing, and final box build. Whether you're launching a new design or scaling a proven product, we help you build with predictable quality, clear documentation, and responsive engineering support.

Turnkey PCBA

We source + assemble + test

Partial Turnkey

You supply key parts, we source the rest

Consigned PCBA

You supply all parts, we assemble

Operators working on an SMT assembly line with inline inspection
SMT + THTMixed Technology
BGA/QFNAdvanced Packages
AOI + X-RayInspection Coverage
ICT / FCTTest Options
NPI ReadyPrototype to Production
Box BuildSystem Integration
ISO 9001:2015Quality System
IPC-A-610 Class 2/3Assembly Standard
RoHSCompliance
ProtectedESD
HandlingMSD
AvailableNDA
SMT + THTMixed Technology
BGA/QFNAdvanced Packages
AOI + X-RayInspection Coverage
ICT / FCTTest Options
NPI ReadyPrototype to Production
Box BuildSystem Integration
ISO 9001:2015Quality System
IPC-A-610 Class 2/3Assembly Standard
RoHSCompliance
ProtectedESD
HandlingMSD
AvailableNDA

Production Capacity & Technical Specifications

State-of-the-art equipment and processes designed for high-volume production with precision quality.

10M+
Components / Day
SMT Placement Capacity
1M+
Components / Day
DIP / THT Capacity
01005
Metric (0402 Imperial)
Minimum Component Size
0.3mm
Fine Pitch BGA/CSP
Minimum Pitch Capability
±25μm
@ 3 Sigma
Placement Accuracy
510×460
mm (20"×18")
Max PCB Size
98–99%
Typical
First Pass Yield
8
SMT Production Lines
Parallel Assembly Capacity
80K CPH
Placement Speed
10+ Zones
Reflow Oven
3D AOI
Inspection System
5DX X-Ray
BGA Inspection
N₂ Ready
Nitrogen Reflow

PCBA Types & Product Requirements

APTPCB supports a wide range of PCBA types. If your project has special requirements, share them early—our assembly plan and quote will align to your acceptance criteria.

SMT + THT Mixed-Technology

Surface mount and through-hole components in a single build with optimized workflow sequencing.

Fine-Pitch & Advanced Packages

BGA, QFN, QFP, CSP placement with appropriate inspection methods and controlled rework.

RF & High-Frequency Assemblies

Process adapted to specialized materials and design requirements for RF applications.

Power & High-Current Assemblies

Heavy connectors, thermal considerations, and high-current path requirements handled properly.

Cables, Harnesses & Integration

Cable assembly, wire harness, and mechanical integration for complete box build solutions.

Flex & Rigid-Flex PCB Assembly

Specialized handling for polyimide substrates with controlled reflow profiles.

Assembly Process & Equipment

Our assembly process is designed for repeatability across prototypes and production with full process controls.

SMT Assembly (Surface Mount Technology)

High-speed placement with repeatability across prototypes and production

SMT Scope

  • Solder paste printing with stencil control
  • Pick-and-place for mixed packages
  • Reflow soldering with profile management
  • Post-reflow inspection and rework controls

Process Controls

  • Paste inspection checkpoints (as required)
  • Component polarity and orientation verification
  • Moisture-sensitive device (MSD) handling
  • ESD handling and protected workflows

Through-Hole Assembly (THT)

Critical for connectors, mechanical strength, and power components

THT Scope

  • Hand soldering and controlled workflows
  • Mixed SMT + THT builds
  • Connectors, transformers, large electrolytics
  • Mechanical components and hardware

Quality Checkpoints

  • Lead protrusion and fillet acceptance checks
  • Polarity checks for diodes/electrolytics
  • Mechanical fit verification
  • IPC workmanship standards compliance

Advanced Packages (BGA / QFN / Fine-Pitch)

Process discipline and inspection strategy for advanced packages

Supported Scenarios

  • Fine-pitch IC placement
  • BGA/QFN device assembly
  • Controlled rework workflows (when required)
  • Package-on-Package (PoP) capability

Inspection Options

  • AOI for surface-level verification
  • X-ray inspection for hidden solder joints
  • Void analysis and acceptance criteria
  • Cross-section analysis (when specified)

Add-On Services

These services are frequently bundled into turnkey PCBA programs.

Conformal Coating
Underfill / Staking
Press-Fit / Insertion
Labeling & Serialization
Firmware Loading
Packaging & Shipping

What Happens After You Send Files

A structured process from file intake to shipping keeps quality, timeline, and documentation predictable.

1

File Intake & RFQ Review

We review BOM integrity, assembly drawing notes, test requirements, target quantities, and lead time for completeness.

2

Engineering Feedback (DFM/DFA)

We flag polarity ambiguities, fine-pitch constraints, stencil aperture risks, and supply-chain issues before building.

3

Sourcing & Kitting

Component availability confirmation, substitution approvals, kitting status, and ETA alignment with your schedule.

4

Assembly Execution

SMT printing → placement → reflow; THT insertion → soldering → inspection, with controlled rework as required.

5

Inspection & Testing

AOI/X-ray/visual inspection per plan, plus ICT/FCT or custom verification per your acceptance criteria.

6

Packaging & Shipping

ESD-safe packaging, labeling/serialization if required, and shipping aligned to your destination and timeline.

Inspection & Test Options

Quality is defined by documented checkpoints aligned to your acceptance criteria.

Automated Optical
AOI
X-Ray Inspection
AXI
In-Circuit Test
ICT
Functional Test
FCT
Visual Inspection
Manual
Solder Paste
SPI
Flying Probe
FPT
First Article
FAI
Burn-In Test
BI
Rework & Repair
Controlled

What to Send for an Accurate PCB Assembly Quote

Provide these files to get a fast, accurate quote—send what you have, we'll tell you what's needed.

Minimum RFQ Package

  • BOM (with manufacturer part numbers)
  • Gerber files + drill files (or ODB++)
  • Pick-and-place / centroid file
  • Assembly drawing (polarity, notes)
  • Quantity and target lead time

Helpful Extras (Improve Speed)

  • AVL / preferred suppliers list
  • Schematic PDF (for ambiguity)
  • 3D step model (mechanical fit)
  • Programming / firmware instructions
  • Testing requirements and fixtures

DFM/DFA Tips to Improve Yield

Use these to reduce iteration time and improve first-pass assembly success.

Provide clear polarity marks for diodes, electrolytics, and IC pin-1 orientation

Keep test points accessible if ICT or production debug is required

Avoid placing tall parts that block AOI view of critical solder joints

Define keepout areas for tooling, depanelization, and coating zones

Confirm package and footprint match in BOM to prevent sourcing mistakes

Document special soldering requirements for thermal mass areas and heavy copper

Teams We Work With

APTPCB PCBA services are frequently used by teams building products in these sectors.

PCBA FAQs

Clarity on turnkey models, NPI support, test coverage, and compliance.

Do you offer turnkey PCB assembly?
Yes. Turnkey PCBA includes component sourcing (as agreed), kitting, SMT/THT assembly, inspection, and test coordination based on your requirements. We also support partial turnkey (you supply key parts) and consigned (you supply all components) models.
Can you handle prototypes and NPI builds?
Yes. We support prototype and NPI programs with revision control, DFM/DFA engineering feedback, a controlled substitution process, and structured build records to reduce iteration time and enable faster ramp to production.
Do you support mixed SMT and through-hole assemblies?
Yes. Mixed-technology builds are common, and we plan the workflow to protect quality and maintain repeatability. THT components like connectors, transformers, and large electrolytics are integrated seamlessly with SMT assembly.
Can you assemble BGA and fine-pitch parts?
Yes. We support advanced packages (BGA, QFN, CSP, fine-pitch ICs) with inspection strategies aligned to your deliverables, including AOI for surface verification and X-ray inspection for hidden solder joints when needed.
What if parts are hard to source or out of stock?
We flag shortages and lead-time risks early, propose alternates only with your approval, and provide a build-ready plan so schedules stay predictable. We can also work with your AVL or preferred suppliers when specified.
Can you perform functional testing?
Yes. Functional testing (FCT) is typically performed using your test procedure, fixtures, and acceptance criteria. We also support ICT when the fixture and method are available, and can coordinate bring-up verification for power-on checks and key-rail validation.
Do you support RoHS/lead-free requirements?
Yes. Lead-free process options are commonly supported. Confirm compliance requirements (RoHS, REACH, etc.) in the RFQ so solder alloys, build plan, and documentation align to your regulatory needs.

Ready to Start Your PCB Assembly Project?

Send your BOM and assembly files—we'll reply with a build plan and quote aligned to your schedule, quality requirements, and documentation needs.