| 370HR | Multifunctional epoxy / E-glass | 4.04 | 0.021 | Industry-standard high-Tg FR-4 with excellent thermal reliability and CAF resistance. Tg 180 deg C (DSC), Td 340 deg C. Very low Z-axis CTE provides robust PTH reliability through lead-free reflow and multiple thermal excursions. Widely specified baseline for server, storage, and networking boards. | Server motherboards, storage backplanes, networking switch boards, general high-reliability multilayer PCBs, automotive body electronics |
| FR408HR | High-performance multifunctional resin / E-glass | 3.68 | 0.0092 | Lead-free compatible mid-loss laminate bridging standard FR-4 and low-loss materials. Tg 190 deg C, Td 360 deg C. 30% improvement in Z-axis expansion and 25% more electrical bandwidth than standard FR-4. Spread-glass weave available. Compatible with AOI and UV-blocking solder mask imaging. | PCIe Gen4/Gen5 host bus adapters, NVMe switch boards, 25G optical transceivers, high-layer-count HDI, data center infrastructure |
| I-Speed | Low-loss epoxy / E-glass | 3.64 | 0.0060 | Low-loss laminate for mid-range high-speed digital applications. Tg 180 deg C, Td 360 deg C. Significant improvement in Df over FR408HR while maintaining FR-4 processing compatibility. Available in spread-glass weave styles for fiber-weave skew control. | 25G SerDes networking, server backplanes, high-speed storage interfaces, PCIe Gen4 switch fabrics, data center ToR switches |
| I-Tera MT40 | Very low-loss thermoset / E-glass | 3.45 | 0.0031 | Very low-loss laminate with Dk stable from -55 deg C to +125 deg C up to W-band frequencies. Tg 200 deg C, Td 360 deg C. Multiple Dk options (3.38, 3.45, 3.60, 3.75) for impedance flexibility. All glass is spread weave. No special PTFE-type through-hole treatment required. Thermally compatible with Astra MT77 for hybrid builds. | 56G PAM4 backplanes, high-speed switch ASICs, 100G/400G Ethernet, automotive ADAS digital processing, hybrid RF/digital boards |
| Tachyon 100G | Very low-loss thermoset / E-glass | 3.02 | 0.0021 | Ultra-low-loss laminate for the most demanding high-speed digital channels. Tg 215 deg C, Td 360 deg C. Thermally compatible with I-Tera MT40 and Astra MT77 for hybrid multilayer constructions. Spread-glass weave for skew control. | 112G PAM4 channels, next-gen data center switch fabrics, HPC interconnects, co-packaged optics host boards, 800G Ethernet |
| Astra MT77 | Ultra low-loss RF/MW thermoset / E-glass | 3.00 | 0.0017 | Ultra-low-loss laminate bridging high-speed digital and RF/microwave. Dk stable from -40 deg C to +140 deg C up to W-band. FR-4-compatible processing - no plasma desmear required. Compatible with lead-free assembly. Shorter lamination time and higher dimensional stability than PTFE alternatives. | 77 GHz automotive radar, 5G mmWave antenna panels, RF/digital hybrid boards, satellite communication, point-to-point backhaul |
| IS550H | Low-CTE, thermally robust / E-glass | 4.43 | 0.016 | Very high thermal reliability with low CTE. Tg 200 deg C, Td 400 deg C. Designed for applications requiring extreme thermal cycling endurance. Excellent CAF resistance and moisture resistance at reflow. | EV power electronics, under-hood automotive control modules, industrial power converters, high-reliability military electronics |