12–48h Fabrication • 72h Assembly • ±5% Impedance
Quick-Turn PCB Prototyping
Dedicated quick-turn lanes build 2–6 layer FR-4 in 12–48 hours and HDI up to 10 layers inside 72-hour windows. You still get Class 2/3 workmanship, 24-hour DFM feedback, and optional turnkey assembly so EVT hardware behaves like production.
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Quick Turn PCB Coverage for Every Board Type
Quick Turn PCB Manufacturing Capabilities
- •Tight 3/3 mil trace/space with controlled impedance coupons
- •Sequential lamination for HDI + fast via-in-pad turnaround
- •Flex, rigid-flex, ceramic, MCPCB, and RF builds under one program

Prototype Through Pilot Production
The Quick Turn Journey
- 1
Concept Proof
Very small quantities (e.g., 5–20 pieces) for design validation, signal integrity checks, and initial functional tests. Lead time: 24-48 hours for FR4.
- 2
Design Verification
Medium quantities to verify manufacturability, test coverage, and reliability before committing to large-scale production. Lead time: 3-7 days for complex boards.
- 3
Pilot Production
Dozens to hundreds of boards for early customer shipments, field tests, or niche products. Seamless transition from prototype lines.
Engineering Support, DFM/DFT, and Quality Control
- Front-end engineering review (DFM/DFT) – We analyze your Gerbers/ODB++, stack-up data, and BOM to detect potential issues such as insufficient clearances, problematic via structures, solder mask slivers, thermal imbalances, or test access limitations.
- Stack-up and material recommendations – For HDI, high-frequency, high-speed digital, ceramic, and metal core quick turn PCBs, we advise on layer structures, dielectric choices, and copper weights that balance performance, cost, and manufacturability.
- Impedance and signal integrity considerations – For RF and high-speed quick turn PCBs, we help ensure that line widths, spacing, and reference planes are compatible with the specified impedance and material properties.
- Process control and inspection – AOI for bare boards and assembled PCBs, electrical testing of PCBs where required, X-ray inspection for BGA and LGA packages, and adherence to recognized IPC class and customer-specific requirements.
- Feedback loop for continuous improvement – Issues found during assembly or testing are fed back to design and process engineering, so subsequent quick turn PCB runs and future mass production benefit from proven design and process optimizations.
Long-Term Manufacturing Strategy
- Multiple PCB technologies under one roof, so your engineering team does not need to manage different vendors for FR4, HDI, ceramic, flex, RF, high-speed, and metal core boards.
- Consistent documentation and traceability, making it easier to maintain quality records, perform audits, and meet regulatory requirements in markets such as automotive, industrial, medical, and telecommunications.
- Flexible logistics and scheduling, with options for expedited shipping, split deliveries, and synchronized shipments of PCBs, components, and assembled boards.
Ready for a 12–48 Hour Build?
Upload files and our engineering team will return DFM notes, stackup guidance, and a confirmed ship date.
Frequently Asked Questions
Answers to the questions we hear most from hardware teams.
How fast can fabrication complete?
Double-sided FR-4 ships in 12–24 h; 4–6 layer stackups run in about 48 h when data and materials are approved.
What about assembly lead time?
Kitted or partial-turnkey SMT can finish in as little as 3–4 days, with 72-hour expedite lanes for critical programs.
What files are required?
Gerber or ODB++, drill files, stackup notes, quantity, target lead time, plus BOM and centroid/XY data for assembly.
Can you run controlled impedance?
Yes—provide target values and tolerance; we will model the stackup, build coupons, and TDR them with ±5% acceptance.
Do you support turn-key assembly?
Yes—BOM sourcing, consigned kits, and mixed-supply options are available for prototype runs.
