Rigid PCB Manufacturing
High-reliability rigid PCB fabrication up to 64 layers with HDI, heavy copper, fine-pitch BGAs, and impedance control. FR-4, low-loss RF materials, and full DFM support.
Manufacturing Capabilities
PCB Manufacturing Capabilities
APTPCB offers comprehensive PCB manufacturing solutions across rigid, flex, HDI, rigid-flex, metal core, and ceramic PCBs. From prototype to mass production, we deliver high-reliability solutions for compute, RF, medical, automotive, and aerospace applications.
Get an Instant Quote
PCB Manufacturing Capabilities
Explore our six core PCB manufacturing capabilities designed for diverse applications and requirements.
Flexible PCB Manufacturing
Flexible PCB (FPC) solutions for compact and lightweight electronics. 1–16 layer flex PCBs with polyimide, PET, PEN, and FR-4 base films, supporting bend-radius optimization.
HDI PCB Manufacturing
Advanced High-Density Interconnect (HDI) PCB solutions enabling compact, high-performance devices. Microvia technology, sequential build-up, fine-line routing, and controlled impedance.
Rigid-Flex PCB Manufacturing
High-quality rigid-flex PCB fabrication up to 32 layers with 0.025 mm flex cores, HDI microvias, fine-pitch BGA support, and comprehensive engineering guidance.
Metal Core PCB Manufacturing
Aluminum, copper-based, and iron-based metal core PCB (MCPCB) manufacturing for LED lighting, power electronics, and automotive applications with superior thermal conductivity.
Ceramic PCB Manufacturing
High-performance ceramic PCB solutions using DPC, LTCC, and DBC technologies. Thermal conductivity 20–220 W/m·K for power electronics, automotive, medical, aerospace, and RF applications.
Ready to discuss your build?
Share your stackup or DFM package and we will return recommendations with lead time and pricing guidance.