Complex Stack-up Support
Up to 64-layer rigid PCBs with engineered stack-ups for HDI, high-speed, and high-copper applications.
Rigid PCB Capability
High-Reliability Rigid PCB Manufacturing Capabilities
APTPCB is a professional PCB manufacturer focused on high-reliability rigid PCBs for industrial, automotive, telecom, medical, and high-speed digital applications. We support complex stack-ups, HDI structures, heavy copper designs, and fine-pitch SMT with comprehensive engineering support.
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Rigid PCB Manufacturing Capabilities
APTPCB is focused on high-reliability rigid PCBs for industrial, automotive, telecom, medical, and high-speed digital applications. Our production lines support complex stack-ups, HDI structures, heavy copper designs, and fine-pitch SMT.
HDI & Advanced Structures
1–3 sequential build-up (SBU) with stacked and staggered microvias, via-in-pad, and fine-pitch BGA support down to 0.3 mm pitch.
Heavy Copper Capability
Up to 20 oz copper thickness for power distribution, thermal management, and high-current applications.
Controlled Impedance
Precise impedance control (±5 Ω for ≤50 Ω, ±7% for >50 Ω) for high-speed digital and RF designs.
Advanced Materials
Support for all mainstream laminates including FR-4, high-Tg, halogen-free, Rogers, Isola, Panasonic Megtron, and PTFE-based materials.
Comprehensive Engineering Support
Free DFM review, stack-up optimization, impedance calculations, and design recommendations for complex projects.
Rigid PCB Manufacturing Capabilities – Detailed Specifications
| Item | Capability | Notes |
|---|---|---|
| Max layer count | Up to 64 layers rigid PCB | Support for highly complex designs |
| Finished board size | Min 10 × 10 mm, max 610 × 1100 mm | Flexible board size range |
| Finished board thickness range | 0.20 – 8.0 mm | Customizable thickness |
| Board thickness tolerance (< 1.0 mm) | ±0.10 mm | Tight tolerance for thin boards |
| Board thickness tolerance (≥ 1.0 mm) | ±10% | Standard tolerance for thicker boards |
| Inner layer min trace/space | 2 / 2 mil | Fine-line capability |
| Outer layer min trace/space | 2 / 2 mil | Fine-line capability |
| Max inner copper thickness | Up to 20 oz | Heavy copper support |
| Max outer copper thickness | Up to 20 oz | Heavy copper support |
| Min mechanical drill / annular ring | 0.15 mm / 0.127 mm | Precision drilling |
| Min laser drill / annular ring | 0.075 mm / 0.075 mm | Microvia laser drilling |
| Mechanical drill aspect ratio | Up to 20:1 | Deep hole drilling capability |
| Laser drill aspect ratio | 1:1 (microvias) | Via-in-pad support |
| Via types | Through-hole, blind, buried, via-in-pad, stacked & staggered microvias | Comprehensive via options |
| Via filling & plugging | Resin-filled, copper-capped, plugged and tented vias available | Via processing options |
| Press-fit hole tolerance | ±0.05 mm | Precision for press-fit components |
| Plated through-hole (PTH) tolerance | ±0.075 mm | Standard PTH tolerance |
| Non-plated through-hole (NPTH) tolerance | ±0.05 mm | NPTH precision |
| Countersink tolerance | ±0.15 mm | Countersink precision |
| Copper-to-board-edge clearance | Standard ≥0.20 mm (tighter on request) | Edge clearance specification |
| Layer-to-layer registration | Typical ±50 μm | Layer alignment precision |
| Solder mask registration | Typical ±75 μm | Solder mask alignment |
| Controlled impedance (single-ended) | ±5 Ω (≤50 Ω), ±7% (>50 Ω) | Single-ended impedance control |
| Controlled impedance (differential) | ±5 Ω (≤50 Ω), ±7% (>50 Ω) | Differential impedance control |
| Impedance support | Impedance coupons and measured report available on request | Impedance validation |
| Standard laminates | All mainstream rigid laminates on the market | Flexible material selection |
| Popular FR-4 materials | Standard FR-4 (Tg 135–150 °C), mid-Tg & high-Tg FR-4 (Tg ≥170 °C), halogen-free FR-4 | FR-4 variants |
| High-speed / RF materials | Rogers RO4xxx/RO3xxx, Isola, Panasonic Megtron series, PTFE-based materials (on request) | Advanced materials |
| Custom laminates | Most commercial laminates can be sourced and matched | Custom material support |
| Solder mask type | LPI (liquid photoimageable) solder mask, matte or glossy | Solder mask options |
| Standard solder mask colors | Green, matte green, black, matte black, white, blue, red, yellow | Standard color palette |
| Custom solder mask colors | Additional colors (grey, orange, purple, etc.) and custom color matching | Custom colors available |
| Min solder mask dam | 0.075 mm | Fine-pitch solder dam |
| Min solder mask opening spacing | 0.10 mm | Solder mask spacing |
| Silkscreen (legend) colors | Standard white and yellow, other colors on request | Legend color options |
| Silkscreen min text height | 0.60 mm recommended | Legend text sizing |
| Surface finishes | HASL, Lead-free HASL (RoHS), ENIG, ENEPIG, OSP, Immersion Tin, Immersion Silver, hard gold for edge fingers | Comprehensive finish options |
| Gold fingers | Bevel 30° / 45°, selectable hard-gold thickness, chamfered edge | Edge finger specifications |
| Peelable mask | Available on request | Special mask options |
| Carbon ink / jumper | Available on request | Special materials |
| HDI capability | 1–3 sequential build-up (SBU), stacked and staggered microvias | HDI support |
| Fine-pitch BGA support | Support for BGAs down to 0.3 mm pitch with HDI via-in-pad fan-out | Fine-pitch BGA capability |
| Board warpage | ≤0.75% (measured per IPC) | Board flatness specification |
| Electrical test | 100% E-test (flying probe or fixture) for all production boards | Comprehensive testing |
| Hi-pot test range | 50 – 3000 V available on request | High-voltage testing |
| Cleanliness / ionic contamination | Process control according to IPC requirements | Quality standards |
| Accepted data formats | Native PCB design files, Gerber, ODB++, IPC-2581, and other common formats | Multiple format support |
| DFM support | Free design-for-manufacturing review, stack-up and impedance suggestions | Engineering support |
| Compliance | RoHS compliant, UL and other certifications for applicable products | Certifications |
| Production types | Quick-turn prototypes, small & medium batch and volume production | Production flexibility |
| Typical lead time | 7–20 working days | Varies by complexity, layer count, and production volume; expedited options available |
Engineered Support for Complex Rigid PCB Designs
Our engineering team is experienced in complex rigid PCB designs including HDI, high layer counts, heavy copper, fine-pitch BGAs, and mixed-signal layouts. We work closely with PCB designers to convert demanding requirements into stable, manufacturable stack-ups.
Stack-up Optimization
Expert guidance on layer configuration, material selection, and impedance planning for optimal performance and manufacturability.
Impedance & Signal Integrity
Controlled impedance design, impedance calculations, and validation for high-speed digital and RF applications.
Via Structure Design
Recommendations for blind/buried vias, via-in-pad, back-drilling, and microvia strategies for complex interconnects.
Material & Process Selection
Guidance on laminate selection, surface finish, solder mask, and special processes tailored to your assembly requirements.
Rigid PCB Applications
High-reliability rigid PCBs are essential for demanding applications across multiple industries.
Industrial & Automation
Control systems, motor drives, industrial equipment requiring robust and reliable PCBs.
Automotive Electronics
Engine control units, power modules, infotainment systems with automotive-grade reliability.
Telecom & 5G
Network infrastructure, base stations, and high-frequency RF modules.
Medical Devices
Diagnostic equipment, implantable devices, and medical sensors with biocompatibility requirements.
High-Speed Digital
Data center, servers, and computing equipment requiring controlled impedance and signal integrity.
Aerospace & Defense
Mission-critical systems with extreme reliability and performance requirements.
Rigid PCB Manufacturing Process
- 1
Design Review & DFM Analysis
Comprehensive review of design files, stack-up verification, impedance validation, and manufacturability assessment.
- 2
Material & Stack-up Planning
Select laminates, define layer configuration, plan copper weights, and establish impedance specifications.
- 3
Inner Layer Patterning
Pattern inner layers, etch circuits, and prepare for lamination with precise registration.
- 4
Lamination & Core Bonding
Laminate layers together under controlled temperature and pressure to create solid multi-layer structure.
- 5
Drilling & Via Processing
Mechanical and laser drilling for through-holes, blind vias, buried vias, and microvias with precision plating.
- 6
Outer Layer Patterning
Pattern outer layers, etch circuits, and apply copper plating with controlled thickness.
- 7
Surface Finish & Assembly Prep
Apply selected surface finish (HASL, ENIG, OSP, etc.), apply solder mask and silkscreen, and perform quality inspection.
- 8
Profile Routing & Final Testing
Route final profile, perform 100% electrical testing, and conduct comprehensive quality verification.
Design for Manufacturability (DFM) Support
Our engineering team provides comprehensive DFM guidance to optimize your rigid PCB designs for performance, reliability, and cost-effectiveness.
Early Design Phase Engagement
Involve APTPCB early for controlled impedance, high-speed, and RF designs. We provide optimized stack-ups and material selection advice.
Impedance & Signal Integrity
Impedance calculations, via structure proposals, and recommendations for solder mask and surface finish.
Special Process Support
Guidance on special laminates, custom solder mask colors, heavy copper, thick gold fingers, and non-standard processes.
Cost Optimization
Design recommendations to balance performance, reliability, and manufacturing cost without compromising quality.
Frequently Asked Questions
What is the maximum layer count for rigid PCBs?
APTPCB supports up to 64 layers for rigid PCB designs. Complex multi-layer stackups require early DFM collaboration to optimize manufacturability, cost, and performance.
What is the minimum trace and space width?
Standard capability is 2/2 mil (0.05 mm) for both inner and outer layers. Tighter geometries down to 1/1 mil are possible after design-for-manufacturing review.
Can you support controlled impedance designs?
Yes, we maintain ±5 Ω tolerance for impedance ≤50 Ω and ±7% for impedance >50 Ω. Impedance is validated with TDR coupons and documented per IPC standards.
What materials do you support?
We support all mainstream laminates including FR-4, high-Tg, halogen-free, Rogers RF materials, Isola, Panasonic Megtron, and PTFE-based materials for specialized applications.
What is the maximum copper weight?
We support up to 20 oz copper thickness for heavy copper applications including power distribution, thermal management, and high-current designs.
Do you offer HDI and advanced structures?
Yes, we support 1–3 sequential build-up (SBU) with stacked and staggered microvias, via-in-pad (VIP), and fine-pitch BGA down to 0.3 mm pitch.
What is your typical lead time?
Lead times typically range from 7–20 working days depending on complexity, layer count, and production volume. Expedited options are available.
Do you provide DFM support?
Yes, we offer free comprehensive DFM review, stack-up optimization, impedance calculations, and design recommendations for all projects.
Partner with APTPCB for High-Reliability Rigid PCB Manufacturing
For controlled impedance, high-speed digital, or RF designs, we strongly recommend involving APTPCB early in the design phase. Our CAM and process engineers are available to review your design rules, propose optimizations, and recommend the most suitable processes for your target performance, reliability, and cost.