HDI PCB Capability
High-Density Interconnect (HDI) PCB Manufacturing
APTPCB specializes in advanced High-Density Interconnect (HDI) PCB solutions enabling compact, high-performance electronic devices. We offer comprehensive HDI manufacturing from concept to production, including microvia technology, sequential build-up (SBU), fine-line routing, and controlled impedance for smartphones, wearables, medical devices, automotive, aerospace, and high-speed networking applications.
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HDI PCB Manufacturing Capabilities – APTPCB
APTPCB is a professional PCB manufacturer and assembler, specialized in advanced High-Density Interconnect (HDI) PCB solutions. We empower the creation of compact, high-performance, and feature-rich electronic devices for industries such as smartphones and mobile devices, wearables, medical equipment, automotive electronics, aerospace & defense, IoT, and high-speed networking.
Our expertise in HDI technology allows us to overcome limitations of traditional PCBs, offering significantly higher connection density, finer lines and spaces, and smaller via holes that enable more complex and miniaturized designs.
We offer comprehensive engineering support from concept to production. We can work with all common PCB engineering data formats, including native design files from mainstream EDA tools like Altium Designer, Cadence Allegro (OrCAD), Mentor Xpedition (PADS), and KiCad. For mass production, we strongly recommend providing standard Gerber and drill files (along with ODB++ or IPC-2581 data) as the final manufacturing package to ensure maximum accuracy and efficiency.
The APTPCB Advantage in HDI PCB Manufacturing
HDI PCBs are crucial for modern electronics demanding smaller footprints, increased functionality, and superior electrical performance. APTPCB leverages cutting-edge technology and processes to deliver advanced HDI solutions, including:
- Microvia Technology: Precisely drilled laser microvias (blind, buried, stacked, staggered, via-in-pad) enable ultra-high routing density and improved signal integrity.
- Sequential Build-Up (SBU): Our multi-lamination processes allow for complex HDI structures (e.g., 1+N+1, 2+N+2, Any Layer HDI/ELIC) that optimize space and performance.
- Fine Line & Space: Achieving minimal trace widths and spaces for high-density interconnects.
- Controlled Impedance: Ensuring precise impedance control for high-speed signal transmission.
- Advanced Materials: Utilizing a wide range of high-performance and specialty materials tailored to your application's requirements.
Our engineering team works closely with you through Design for Manufacturability (DFM) reviews to optimize your HDI stack-up, microvia design, material selection, and routing strategies, ensuring a robust, reliable, and cost-effective product.
HDI PCB Manufacturing & Assembly Capabilities – APTPCB
| Item | Capability | Notes |
|---|---|---|
| Max Layer Count | Up to 32 Layers (Standard), 64 Layers (Advanced) | For highly complex and integrated designs. |
| HDI Build Configurations | 1+N+1, 2+N+2, 3+N+3, 4+N+4, Any Layer HDI (ELIC) | Covers a full spectrum from moderate to ultra-high density interconnection. |
| Min Trace/Space (Finished) | 3 / 3 mil (0.076 mm) | Tighter capabilities down to 2/2 mil (0.0508 mm) possible after DFM review. |
| Min Flex Core Thickness | 0.001" (0.025 mm) | For adhesiveless polyimide film (relevant for HDI rigid-flex). |
| Copper Weights (Finished) | 0.5 oz – 2 oz (18 µm – 70 µm) | Standard for HDI. Up to 3 oz (105 µm) in specific rigid core layers. |
| PCB Thickness | 0.40 mm – 8.0 mm | Customizable based on application and layer count. |
| Max Panel Size | 24 × 18 inch (610 × 457 mm) | Optimized for laser drilling machine capabilities. |
| Min Mechanical Drill Diameter | 0.006" (0.15 mm) | For through-holes in core layers. |
| Min Laser Drill Diameter (Microvia) | 0.003" (0.075 mm) | Advanced capability for microvias. Standard is 0.004" (0.10 mm). |
| Microvia Types | Blind Microvias, Buried Microvias, Stacked Microvias (Copper-filled), Staggered Microvias, Via-in-Pad (VIP) | Supporting complex HDI layer interconnections. |
| Max Through-Hole Aspect Ratio | 10 : 1 | For mechanical drills. |
| Max Blind Via Aspect Ratio | 0.75 : 1 | For laser-drilled microvias. |
| Min Finished Hole Size (PTH) | 0.006" (0.15 mm) | Smallest finished plated through-hole. |
| Min Annular Ring | 1 mil (0.025 mm) | For reliable via connections. |
| Controlled Impedance Tolerance | ±5% | Highly precise control for critical high-speed signals. |
| Base Materials | FR4 (Standard/Mid/High Tg), Halogen-free FR4, Polyimide, Rogers, Arlon, Teflon, Taconic, Specialty High-Frequency Materials | Diverse material selection for optimal electrical and thermal performance. |
| Surface Finishes | ENIG, Immersion Tin, Immersion Silver, OSP, Electrolytic Gold (Hard/Soft), Lead-free HASL | Comprehensive options including Soft Wire Bondable Gold. |
| Solder Mask Colors | Green, Black, Blue, Red, White | Other colors available on request. |
| Solder Mask Registration | Within 0.002" (0.051 mm) | For precise solder mask openings. |
| Solder Mask Min Dam Size | 0.003" (0.076 mm) | For fine pitch components to prevent bridging. |
| Legend (Silkscreen) Colors | White, Black, Red, Yellow | Other colors available on request. |
| Min Legend Line Width/Height | 3.5 / 20 mil (0.089 / 0.508 mm) | For clear marking on dense boards. |
| Thickness Tolerance | ±0.002" (±0.051 mm) or ±10% (whichever is greater) | For precise board stack-up. |
| Bow & Twist | ≤ 0.05% (typical, per IPC measurement) | For optimal flatness in complex HDI structures. |
| Filled Vias | Conductive Filled Vias (e.g., copper-filled), Non-Conductive Filled Vias | Essential for stacked microvias and enhanced thermal management. |
| Sequential Laminations | Up to 4 sequential laminations | For building advanced HDI structures. |
| Quality Standards | IPC-A-600 Class 2 / Class 3 | All PCBs manufactured to rigorous industry standards. |
| Certifications | ISO 9001:2015, UL Certified | RoHS & REACH compliant; IATF 16949 (for automotive) on request. |
| Electrical Test | 100% E-test (Flying Probe or Fixture Test) | Comprehensive testing for opens/shorts and continuity. |
| Quality Control & Inspection | AOI (Automated Optical Inspection), 3D AOI, 3D SPI (Solder Paste Inspection), X-Ray Inspection, First Article Inspection | Multi-point inspection throughout manufacturing, ensuring highest quality. |
| DFM Support | Comprehensive DFM review by our engineering team | Free service to optimize manufacturability, reliability, and cost-effectiveness of HDI designs. |
| Production Types | Prototypes, Small/Medium Batches, Volume Production | Flexible production scale to meet diverse customer needs, from quick-turn prototypes to mass production. |
| Typical Lead Time | 7-25 working days (varies by complexity and quantity) | Quick-turn options available for prototypes and urgent orders. |
Integrated HDI PCB Assembly Services
APTPCB offers comprehensive HDI PCB assembly services, providing a complete, turnkey solution from bare board manufacturing to fully tested, functional products.
| Item | Capability | Notes |
|---|---|---|
| Min SMT Component Size | 01005 (0.4 × 0.2 mm) | For ultra-dense component placement. |
| Min BGA / CSP Pitch | 0.3 mm (12 mil) | Accurate placement for extremely fine-pitch packages (e.g., CPU, GPU). |
| Max Component Height | Up to 25 mm (top/bottom side) | Accommodating various component profiles. |
| Assembly Technologies | SMT (Surface Mount Technology), THT (Through-Hole Technology), Mixed Assembly | Full range of assembly options. |
| Soldering Processes | Lead-free Reflow, Wave Soldering (for THT), Selective Soldering | Optimized processes for different component types and materials, ensuring robust solder joints. |
| Inspection & Testing | AOI, 3D AOI, 3D SPI, X-Ray Inspection, ICT, FCT | Rigorous post-assembly inspection to ensure quality, functionality, and solder joint integrity. |
| Conformal Coating | Available on request | For environmental protection in harsh conditions. |
| Component Sourcing | Full Turnkey (Component Procurement & Assembly) | Streamlined supply chain management, ensuring high-quality and on-time component delivery. |
Your Partner for Next-Generation HDI PCB Innovation
The complexity of HDI PCBs demands close collaboration between designer and manufacturer. APTPCB encourages early engagement to leverage our expertise throughout your product development lifecycle.
Share your preliminary layout, stack-up requirements, and performance targets with our engineering team. We provide:
- Expert Stack-up & Microvia Design Guidance: Optimizing layer configurations and microvia placement for maximum routing efficiency and signal integrity.
- Material Selection Support: Advising on the best high-performance, low-loss, or specialty materials for your specific electrical and thermal needs.
- Comprehensive DFM & DFA Reviews: Proactively identifying and resolving potential manufacturing and assembly challenges.
- Signal & Power Integrity Analysis: Ensuring robust electrical performance for high-speed designs.
By partnering with APTPCB, you gain a trusted advisor dedicated to transforming your innovative HDI designs into reliable, high-performing, and cost-effective products, accelerating your time-to-market.
Frequently Asked Questions
Which HDI configurations do you support?
1+N+1, 2+N+2, 3+N+3, 4+N+4, and ELIC (Every Layer Interconnect) for density tiers from moderate to ultra-high.
What microvia sizes and types are available?
Laser microvias down to 0.075–0.10 mm; blind, buried, stacked, staggered, and via-in-pad (VIP) with copper fill and planarization.
What are the minimum trace/space capabilities?
Standard 3/3 mil (0.076 mm) with potential 2/2 mil after design-for-manufacturing review.
Do you support controlled impedance and SI/PI validation?
Yes—±5% impedance tolerance with tuned stack-ups, trace geometries, TDR coupons, and SI/PI review when required.
What data formats should I provide for production?
We accept native Altium, Allegro/OrCAD, Xpedition/PADS, KiCad, etc. For mass production, please supply Gerber and drill (ODB++ or IPC-2581 preferred) to ensure accuracy.
Partner with APTPCB for Next-Generation HDI PCB Innovation
Share your preliminary layout, stack-up requirements, and performance targets—our engineers will return feasibility, risk points, and build options for your HDI program.