LARGE FORMAT • 112G READY
Extra-large backplanes up to 1100 × 500 mm with 24–50 layers, low-loss laminates, ±5% impedance, and CNC backdrill keep data center and telecom fabrics reliable at 112G.
APTPCB engineers design low-loss, high-layer stackups with stripline groups, dedicated reference planes, and copper balancing for massive panels.
We coordinate press-fit connector footprints, dual backdrill passes, and depth verification so SERDES lanes meet insertion loss budgets.
Assembly support covers selective solder, press-fit tooling, and conformal coating to deliver production-ready chassis and fabrics.
Hyperscale data center, telecom, industrial automation, and aerospace backplanes built on our lines.
All backplanes receive impedance coupons, backdrill logs, AOI/X-ray, Hi-Pot, and optional S-parameter testing to ensure compliance up to 112G.
Dedicated engineering, low-loss materials, and large-panel processing for mission-critical backplanes.
Data center, telecom, industrial, and aerospace backplanes with stripline routing and heavy copper.
Select low-loss laminates (Megtron, Tachyon, I-Speed) and copper thickness optimized for press-fit connectors.
Backplanes undergo impedance testing, IR/s-parameter correlation, AOI, X-ray, and Hi-Pot up to 4 kV to satisfy telecom and aerospace specs.
Stackup & SI Review
Align loss budgets, conductor roughness, and reference planes.
Core Prep & Imaging
Large-format imaging for long traces.
Sequential Lamination
Multiple cycles for high-layer builds.
Drilling & Backdrill
Deep drilling plus CNC backdrill with verification.
Surface Finish & Mask
ENIG/ENEPIG + color-coded masks for assembly.
Testing & Validation
Impedance, electrical, Hi-Pot, and reliability tests archived.
CAM + SI teams create stackups, impedance tables, and drill/backdrill files.
SPC on lamination, drilling, plating, and press-fit zones with feedback loops.
Max Panel
Supports large chassis
Layer Count
Sequential lamination
Impedance
Coupon verified
PAM4 Ready
Low-loss materials and backdrill
High signal integrity, large format, and robust power delivery.
24–50 layers with dedicated signal/power groups.
Low-loss laminates and backdrill for 112G links.
Tight hole tolerances and plating.
Comprehensive SI + electrical testing.
Reduces harness complexity and rework.
Stackup, drill, and test packages provided.
Processes panels up to 1100 × 500 mm with controlled flatness for chassis backplanes.
CAM + SI engineers co-own backdrill tuning, launch optimization, and compliance reports.
Integrated backplanes simplify wiring, improve reliability, and scale to hyperscale bandwidth needs.
Hyperscale networking, telecom infrastructure, industrial automation, and aerospace systems rely on high-layer backplanes.
Large-format processing and low-loss materials keep links stable at scale.
Switches, routers, and base stations.
Leaf-spine fabrics and accelerator backplanes.
Mission computers, radar, and avionics racks.
Factory control and power distribution chassis.
Test benches and charging infrastructure.
ATE interfaces and load banks.
High-channel-count imaging systems.
Folded harness replacements for compact enclosures.
Control loss, backdrill, impedance, and warpage on massive boards.
Low-loss materials and copper roughness must align with 112G budgets.
Multiple depths need clear documentation and verification.
Large panels warp without copper balancing.
Tight hole tolerances and plating thickness are critical.
Customers require detailed stackup, drill, and test data.
Large boards must ship flat without damage.
Loss Modeling
Stackup + SI models keep insertion loss on target.
Backdrill Playbooks
We create drill tables, tolerances, and verification steps.
Copper Balance & Panel Design
Thieving and cross-hatching control warpage.
Press-Fit Guidelines
Hole size, plating, and finish rules documented.
Packaging Kits
Custom crates and supports ship large panels safely.
Innovation Roadmap
Emerging technologies shaping the future of manufacturing, signal integrity, and system integration.
01
Short-reach optical engines move onto the backplane, demanding hybrid fiber and low-loss routing in the same laminate stack.
02
Semi-additive copper builds unlock finer stripline density so 224G+ lanes fit without growing the panel outline.
03
Embedded cold plates and dielectric liquid loops migrate onto the backplane frame to dissipate accelerator heat directly.
04
Real-time digital twins pair AI analytics with channel telemetry to predict SI drift and retune fabrics before hardware ships.
Low-loss materials, backdrill, and large panels add cost—apply premium features only where needed. Reuse stackups, drill sets, and panel sizes across chassis to minimize NRE. Provide insertion loss, connector types, and panel constraints so we can scope the leanest solution.
Use common high-layer stackups across product lines.
Run full SI testing for qualification, sampling for production.
Early review avoids over-spec’d copper or via rules.
Optimize outlines and fiducials for maximum yield.
Select ENIG/OSP combos depending on assembly needs.
Reuse drill hits and lamination tooling to reduce NRE.
Combine similar depths to cut machine time.
Reserve low-loss laminate lots for ongoing programs.
Quality, environmental, and industry credentials supporting reliable manufacturing.
Quality management across sequential lamination and drilling.
Environmental controls for copper plating and prepreg handling.
Traceable documentation for regulated industrial and medical systems.
Automotive-grade SPC, PPAP, and CAPA coverage.
Aerospace process governance for mission-critical backplanes.
Class 3 acceptance for rigid and rigid-flex structures.
Safety and flammability compliance for global deployments.
Hazardous substance controls for export shipments.
Quality & Cost Console
Unified dashboard connecting HDI quality checkpoints with the economic levers that compress cost.
Process & Reliability
Stack-Up Validation
Pre-Lamination Strategy
• Rotate outlines, mirror flex tails
• Share coupons across programs
• Reclaim 5-8% panel area
Registration
Registration
Laser Metrology
• Online laser capture
• ±0.05 mm tolerance band
• Auto-logged to SPC
Testing
Testing
Electrical Test
• TDR coupons per panel
• IPC-6013 Class 3
• Force-resistance drift logged
Integration
Integration
Assembly Controls
• Nitrogen reflow
• Inline plasma clean
• 48h logistics consolidation
Architecture
Architecture
Cost Strategy
• Balance cost vs performance
• Standardize on common cores
• Low-loss only on RF layers
Microvia Planning
Microvia Planning
Via Cost Savings
• Avoid stacked microvias
• Share backdrill tools
• Minimize fill costs
Utilization
Utilization
Panel Optimization
• Rotate for nesting efficiency
• Share test coupons
• Standardize tooling
Execution
Execution
Supply Chain Levers
• Pool low-loss material
• Dual-source laminates
• Match finish to need
Send stackups, panel drawings, and connector maps—our team replies with DFx notes, SI plans, and schedules within one business day.
Questions on panel size, materials, and validation.
