Materials
We stock fluoropolymer laminates pulled directly from Rogers, Taconic, and Arlon line cards (RO3003/RO3035, RT/duroid 5880, TLY-5A, CLTE-XT). Using the plasma, drilling, and validation practices we captured from RayPCB mirror projects, we keep Df ≤0.0015 and impedance within ±3–5% for radar, satcom, and phased-array builds up to 77 GHz.
Df 0.0009–0.0015 with tight Dk tolerances keeps mmWave feed networks stable through -55↔125 °C environmental sweeps.
Hybrids place PTFE only on RF layers while FR-4 or BT core handles control logic and stiffeners, cutting BOM cost 30–50%.
Low surface energy PTFE requires tuned plasma desmear and reduced chip-load drilling to ensure reliable vias.
Top fluoropolymer series sourced for radar, satcom, and phased-array builds.
| Series | Use Case | Models |
|---|---|---|
| Rogers RO3000™ | Low-loss RF/microwave hybrids | RO3003, RO3035, RO3010 |
| Rogers RT/duroid® | Space/satcom and automotive radar | RT/duroid 5880, 5870, 6002 |
| Taconic TLY/TLX | mmWave antennas & couplers | TLY-5A, TLX-8, TLX-9 |
| Arlon CLTE-XT / AD | Low PIM phased arrays | CLTE-XT, AD255C |
| Bondply & Adhesives | Hybrid integration | fastRise®, 2929 bondply, thermoset films |
| Material | Dielectric Constant @10 GHz | Dissipation Factor | Thermal Conductivity (W/m·K) |
|---|---|---|---|
| RO3003 (0.010 in) | 3.00 ±0.04 | 0.0010 | 0.50 |
| RO3035 (0.020 in) | 3.50 ±0.05 | 0.0017 | 0.50 |
| RT/duroid 5880 (0.020 in) | 2.20 ±0.02 | 0.0009 | 0.22 |
| TLY-5A (0.010 in) | 2.17 ±0.02 | 0.0009 | 0.23 |
| CLTE-XT (0.014 in) | 2.94 ±0.02 | 0.0015 | 0.30 |
Numbers pulled from vendor datasheets; always confirm against lot-specific certificates shipped with your order.
RF microstrip outers on RO3003 with FR-4 control planes and 2929 bondply.
Pure PTFE stack for 77 GHz antenna with aluminum backer.
CLTE-XT RF layers, FR-4 logic, copper coins under LNAs.
PTFE holes cleaned via O2/Ar plasma before electroless copper.
Reduced chip load and optional laser drilling keep hole quality intact.
fastRise® or 2929 bondply uses staged pressure/temperature cycles.
TDR/VNA testing with coupon microsections for every PTFE lot.
RT/duroid 5880 + aluminum backers for ADAS radar modules.
RO3003/CLTE-XT hybrids with copper coins and thermal straps.
RO3035 + FR-4 hybrids for 3.3–4.2 GHz beamformers.
Inputs we collect before freezing a PTFE/Teflon stackup.
Document band, launch style, and allowable insertion loss.
Decide which layers remain PTFE and where FR-4/metal handles support.
Agree on coupon placement, solver data, and ESS/thermal screening.
Yes. RO3003/3035, RT/duroid 5880, TLY-5A, and CLTE-XT cores plus fastRise®/2929 bondply are stocked. Specialty thicknesses can be pulled in 5–7 days.
We plasma-treat holes, reduce drill chip load, bake before plating, and run IST/TDR coupons to verify adhesion.
Yes. We run hybrid stacks with FR-4, BT, or metal backers by matching bondply, balancing CTE, and logging press profiles.
