FR-4 PCB
MainstreamStandard FR-4 builds for cost-effective programs.
- Standard stackups
- Lead-free capable
- IPC class II/III
PCB Manufacturing
FR-4, HDI, RF & Rigid-Flex PCB Manufacturing
Stackup strategy, impedance control, and yield windows from prototype through MP. HDI, RF, rigid-flex, and metal cores with automotive-grade quality gates.
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PCB Portfolio
Manufacturing Paths for Every Performance Envelope
Each product path is engineered with dedicated tooling, material strategy, and quality checkpoints to meet signal integrity, thermal, and reliability targets from prototypes to mass deployment.
High-Speed PCB
Signal IntegrityLow-loss, tight tolerance stackups for high-speed links.
- Megtron / Tachyon / VT-47
- Tight impedance
- Backplane ready
HDI PCB
Any-LayerBlind/buried vias, stacked uVias for dense layouts.
- Any-layer HDI
- Stacked microvias
- Fine-pitch BGA
Microwave PCB
RFPTFE and hydrocarbon ceramics for RF paths.
- Rogers / Taconic
- Tight Dk/Df
- Antenna ready
Multilayer PCB
Stack DepthDeep layer counts with controlled impedance.
- Up to 40 layers
- Backdrill options
- Rigid cores
Rigid-Flex PCB
3D RoutingHybrid rigid-flex for compact enclosures.
- Bookbinder builds
- Dynamic bend
- Stiffeners
Flex PCB
DynamicSingle/dual-layer flex for interconnect and wearables.
- PI / LCP
- Dynamic bend life
- EMI shielding
Backplane PCB
High LayerLong-run, thick copper backplanes for telecom/datacom.
- Thick cores
- Low-loss
- Press-fit ready
Metal Core PCB
ThermalAluminum / copper cores for thermal management.
- MCPCB
- TIM options
- LED and power
Ceramic PCB
High TempCeramic substrates for high temp / RF stability.
- AlN / Al2O3
- Good CTE match
- RF friendly
High-Tg PCB
ThermalHigher Tg materials for thermal reliability.
- Tg>170C
- Lead-free capable
- Thermal cycling
Heavy Copper PCB
PowerThick copper for high-current power designs.
- Up to 6 oz
- Plated bus bars
- Thermal relief
Antenna PCB
RFCustom antenna boards on RF laminates.
- RF stackups
- Tight phase control
- Array support
High-Frequency PCB
Low-LossLow-loss materials for mmWave and high-speed.
- Dk/Df control
- Hybrid builds
- Smooth copper
High-Thermal PCB
ThermalThermal vias, metals, and stackups for heat spread.
- Thermal vias
- MCPCB options
- Copper coins
Engineering Toolkit
Design & Verification Tools for Faster Builds
Validate stackups, inspect Gerbers, and run quick simulations without leaving the manufacturing workflow.
Gerber Viewer
View Gerbers online for quick checks.
Launch Viewer3D PCB Viewer
Inspect 3D PCB models in browser.
Open 3D ViewerImpedance Calculator
Solve microstrip/stripline quickly.
Run CalculatorCircuit Simulator
Simulate circuits online without install.
Open SimulatorManufacturing Assurance
Process windows are matched to target stackups, copper distribution, and reliability requirements. Our MES and SPC systems surface trends before they impact production builds.
Statistical Process Control
SPC-driven runs with monitored Cp/Cpk.
Material Controls
Approved vendors and lot-level traceability.
Impedance Tuning
Coupon-driven impedance adjustments.
Lamination Discipline
Documented press cycles and resin flows.
Applications & Case Outcomes
Customer programs span automotive ADAS controllers, industrial automation backplanes, telecom switching, and medical imaging modules. Typical results include <20 PPM field returns and 10–15 day ramp-to-mass-production.
Automotive Domain Controllers
12-layer HDI with blind/buried vias, ±5% impedance, PPAP documentation, <15 PPM over 18 months.
Telecom Fabric Backplanes
48-layer backplane with backdrill, Dk 3.5 hybrid stackups, BER <1e-12 at 25 Gbps post-install.
Need engineering review before release-to-build?
Share stackups, Gerbers, and impedance targets. Our CAM and SI teams respond within 24 hours with a manufacturability plan.
Frequently Asked Questions
Answers to the questions we hear most from hardware teams preparing builds.
How fast can you turn a PCB prototype?
Prototypes ship in as fast as 48-72 hours depending on stackup and materials.
Do you support impedance control?
Yes, we target ±5% with coupon validation and can tune for low-loss builds.
Can you handle HDI and microvias?
We support blind/buried vias, stacked uVias, and any-layer HDI with rigorous reliability checks.