Unified Manufacturing Engine

Orchestrating High-Reliability Electronics.

We align multilayer PCB fabrication, turnkey assembly, and compliance support into a single, audit-ready manufacturing stream.

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Precision Engineering

IPC Class 3 standards compliant. Advanced HDI and rigid-flex capabilities for mission-critical applications.

Rapid Scale-Up

Seamless transition from prototype to mass production. Automated assembly lines ensuring consistent quality.

Global Logistics

Optimized supply chain management. Worldwide shipping with real-time tracking and customs support.

What We Specialize In

Engineered for Complexity.

Our core competencies across PCB manufacturing, PCBA assembly, and quality assurance—designed to handle the most demanding specifications in the industry.

PCB Manufacturing

Advanced Fabrication Technology

Premium Materials

We partner with industry-leading material suppliers to ensure signal integrity and reliability.

Advanced PCB Manufacturing
2mil
Min. Trace/Space
0.15mm
Min. Drill Size
±5%
Impedance Control
One-Stop Assembly

Seamless Turnkey Integration

From component sourcing to final box build, we manage the entire lifecycle with rigorous quality control.

Turnkey Assembly

  • • SMT & Through-Hole
  • • BGA / QFN / Fine Pitch
  • • 0201 Component Placement
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Testing & Quality

  • • AOI & X-Ray Inspection
  • • ICT (In-Circuit Test)
  • • Functional Testing (FCT)
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Box Build

  • • Firmware Loading
  • • Cable & Wire Harness
  • • Conformal Coating
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Component Sourcing

  • • BOM Management
  • • Supplier Coordination
  • • Inventory Control
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NPI & Small Batch

  • • Rapid Prototyping
  • • Design Validation
  • • Quick Turnaround
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Technical Excellence

Engineering Capabilities

Pushing the boundaries of what's possible with cutting-edge manufacturing processes and materials.

Rigid PCB

  • Up to 64 Layers
  • ±5% Impedance Control
  • Blind & Buried Vias
  • Class 3 Reliability
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Rigid & Flex

  • Up to 64 Layers (Rigid)
  • Up to 12 Layers (Flex)
  • Any-Layer HDI
  • Staggered/Stacked Vias
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Flex PCB

  • Dynamic Flex Stackups
  • Adhesiveless Copper
  • Coverlay Registration ≤35µm
  • Bend Qualification
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HDI PCB

  • 1+N+1 to 5+N+5 HDI
  • 0.10mm Microvias
  • Copper-Filled VIPPO
  • Sequential Lamination
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Metal PCB

  • Aluminum / Copper Core
  • >12 W/m·K Thermal Path
  • Heavy Copper (up to 12oz)
  • Embedded Coin
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Ceramic PCB

  • Alumina & AlN Substrates
  • High Thermal Conductivity
  • RF/Microwave Applications
  • Extreme Reliability
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Surface Finish

  • ENIG / ENEPIG
  • Immersion Silver/Tin
  • Hard Gold / Gold Fingers
  • OSP / HASL
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Ready to Scale?

Join the world's leading innovators who trust APTPCB with their most critical electronics.